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In 2004, Intel shipped millions of products in compliance with new lead-free
regulations.
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Highlighting a comprehensive focus on environmentally sensitive
product and packaging design, Intel shipped an increasingly lead-free product
lineup in 2004.
Progress on lead-free products
In 2004, Intel announced that we will be eliminating approximately 95% of the
lead used in our processors and chipsets. We are taking steps to make our
products more environmentally friendly, meet the needs of our customers, and
meet and exceed new materials regulations.
Shipping its first lead-free memory chips in 2003, Intel added microprocessors,
chipsets and embedded processors to the company's lead-free product lineup in
2004. Intel's transition to lead-free will continue as our customers and
product manufacturers are able to handle additional lead-free components. New
packages use lead-free solder balls, about the size of salt crystals, and
replace the majority of lead previously used in our microprocessor packaging.
Intel is working with the industry to find a reliable solution for the tiny
amount of lead still needed inside the processor packaging to connect the
actual silicon "core" to the package.
To perfect flip-chip packages as well as printed circuit-board assembly, we used
our assembly development lines in Arizona, Oregon and Malaysia. This gave
customers a reference point from which to start redesigning their own printed
circuit-board assembly processes and bring them into alignment with Intel's
lead-free solution.
The transition to lead-free is a massive industry-wide effort with many
technological, logistical and economic challenges. Since 2000, Intel has been
working with industry consortia and the European Union's Restriction of
Hazardous Substances (RoHS) legislation committee to promote a solution that
can be used worldwide.
Strides in product packaging
Intel's Packaging Engineering team continues to look for opportunities to
improve year-over-year performance in the amount and type of packaging the
company uses. With over 70 specific projects completed, the team closed 2004
with more than $1.5 million in cost savings. These savings represent the
elimination of more than 250,000 pounds of paper; 2,000 pounds of plastic;
close to 34,000 pounds of wood; and more than 47,000 pounds of non-recyclable
packaging.
Converting the existing packaging system for the Intel® PRO/Wireless 2915ABG
Network Connection into individual clam-shells made of plastic and cardboard
rather than nonrecyclable bags saved an estimated 250,000 pounds of paper and
46,300 pounds of non-recyclable materials in over 21 million shipped units. The
solution also allows Intel to move 66% more product per shipment, further
reducing fuel consumption and emissions during transportation.
EPEAT performance
Intel played a key role in establishing a new tool, called EPEAT (for
Electronic Product Environmental Assessment Tool), to help U.S. federal
purchasers gauge the overall environmental performance of computers, laptops
and displays. EPEAT represents the outcome of a multi-stakeholder process with
the goal of promoting improved environmental design and practices. EPEAT
stakeholders strongly believe that the tool will provide purchasers with a
simple and verifiable program for promoting environmentally sustainable
technologies and practices.
www.epeat.net
Rethinking PC end-of-life
As the technology industry continues to develop new and exciting products,
industry, government, businesses and consumers will need to work together to
dispose of old equipment responsibly. In early 2005, eBay and Intel launched an
initiative called Rethink that creates a new, innovative means of dealing with
old electronics on the world's largest e-commerce site. With Rethink, consumers
can assess the value of their old equipment and choose the best options for
reuse or recycling. We believe that this market-based approach with appropriate
controls is the best way to cope with e-waste. Intel worked with eBay and other
key stakeholders from business and non-governmental organizations (NGOs) in the
early stages of the program and continues to participate as a key partner in
the Rethink initiative.
The focal point of the initiative is an online Rethink hub, intended to educate
consumers about responsible product disposition solutions and the resources
available to them. The hub features:
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Educational
resources for consumers |
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Pathways,
tools and resources for recycling and reuse solutions on and off eBay |
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An
invitation to industry, government and NGO stakeholders to become involved |
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In addition to Intel, the EPA, National Cristina Foundation, International
Association of Electronics Recyclers, Earth 911 and Silicon Valley Toxics
Coalition support the Rethink initiative. In 2005, Rethink will continue to
grow in terms of electronics products and geographies covered.
http://pages.ebay.com/rethink
Community electronics recycling
In 2004, Intel conducted community PC collection events at seven of our U.S.
site locations. We collected more than 357,000 pounds of electronics, mainly
PCs, associated equipment and TVs from approximately 3,000 local participants.
Although the number of collection events remained constant from 2003, the total
material collected increased 49% in 2004. Our collection initiatives over the
last two years have diverted more than 500,000 pounds of e-waste from
landfills.
With only 650 employees, our site in New Jersey attracted 276 cars, trucks and
even buses from neighboring school districts to its electronics collection
event. Participants brought 84,826 pounds of electronics, including more than
1,000 computer monitors.
In addition to the U.S. events, Intel Ireland, in conjunction with the Kildare
County Council, held three Electronics Recycling collections, in Leixlip,
Maynooth and Celbridge. These highly successful events collected more than
1,000 computers, printers, monitors and related electronics, diverting them
from landfills or improper disposal.
Designing for power efficiency
Intel was one of the first companies to anticipate the trends and clarify the
scope of the power challenge faced by the computing and communications
industry. We are leading the industry in innovative design solutions and are
working with other companies and organizations that have joined the challenge
of designing for power efficiency.
Intel engineers examine every aspect of the design, manufacture and use of
computing devices, looking for variables that could influence the power
equation. We are exploring new process technologies, breakthrough transistor
materials and structures, innovative circuit and microarchitecture designs,
novel packaging materials and techniques, improvements to system components,
and software optimization techniques that provide comprehensive power-efficient
solutions.
The next decade will see a number of architectural changes at every level—from
transistor structure to the integration of entire systems—that will continue to
drive to a key goal: to maximize power efficiency at every phase of design.
http://download.intel.com/technology/silicon/power/download/design4power05.pdf
