Product Packaging

To reduce packaging waste and costs, in 2007 Intel launched new protective packaging for multiple product lines. The new designs decreased the amounts of paper and plastic materials used. We reduced the size of the packaging, eliminated packaging components, and incorporated more recyclable materials. The designs also improved shipping density, which reduced the number of shipments required and therefore the amount of fuel consumed and resultant emissions per unit shipped.

Recent packaging innovations include:

Reducing the size and costs of packages for single motherboards while using foam cushioning that is recyclable
Decreasing bulk-pack motherboard packaging size by an average of 16 percent
Developing a universal packaging component that reduced our boxed server processor packaging size by 40 percent
Reducing mobile processor packaging size, thereby eliminating 28 percent of paper and 40 percent of plastic materials. We also reduced the number of thermoform components for mobile processor packaging from three to two

As we continue to improve Intel's packaging, all boxed packaging for CPUs will be reduced in size and weight. We expect these redesigns will eliminate approximately 3.5 million pounds of packaging waste annually.

Environment

Product Packaging