They're faster, they use less power and they're better equipped to multitask. Dual-core chips are more efficient at running multiple resource-demanding tasks at the same time - like downloading large files while using Photoshop. Dual-core chips are also smaller and less expensive to manufacture.

Exactly. Intel® says the names are picked from a list of towns close to where the chips are manufactured. Merom, for example, is an archaeological site in Israel that lies close to a processor-manufacturing plant. Intel® has been naming chips after geographical locations ever since the release of the Pentium 2 in 1997.

You can, but Core™ i7 isn’t created with laptops in mind. The main aspect, mobility, will be compromised; the battery life would be very small, compared to Centrino®- equipped laptops.

Intel® intends to scale down the Nehalem architecture (used to create i7) for other chips that will go in mainstream desktops and laptops. Intel® will also integrate graphics capabilities in the CPU down the line, which should bring more power-efficiency to laptops.

A Mobile Internet Device (MID) is a multimedia-capable handheld computer providing wireless Internet access. They are designed to provide entertainment, information and location-based services for personal use, rather than for corporate use. MIDs are larger than smartphones but smaller than the Ultra Mobile PC (UMPC). Intel® MID platforms are based on an Intel® processor and chipset which consume less power than most of the x86 derivatives and are previously an extension of the Centrino® mobile platform for Menlow platform (Silverthorne).

Centrino® is a technology package from Intel® that provides built-in wireless support for laptops while making it possible to run a laptop all day (up to seven hours) without a battery recharge. Through Centrino®, Intel® hopes to encourage corporations and users to replace their current laptops with a newer, more mobile version. The Centrino® package consists of:

• A Mobile processor
• A mobile Express Chipset
• A Wireless network connection

Pentium/Core™/Core™2 Duo/i7 are Intel® processors, whereas Centrino® is a mobile platform. The Centrino® 2 platform (2008) consists of:

• an Intel® Mobile 4 Express series chipset
• a second-generation Intel® Core™ 2 Duo 45nm processor
• any of the following wireless platforms:
  • Intel® Ultimate N WiFi Link 5300 mini-PCIe adapter
  • Intel® WiFi Link 5100 mini-PCIe adapter
  • Intel® WiMAX/WiFi Link 5350 mini-PCIe adapter
  • Intel® WiMAX/WiFi Link 5150 mini-PCIe adapter

The clock speed (GHz) and an unlocked multiplier are the only differences between Core™ 2 duo and Core™ 2 extreme. The Core™ 2 Duo is downward unlocked. Core™ 2 Extreme: 4 MB of shared L2 Cache
1066 MHz front-side bus

Core 2 Extreme Quad:
8 MB of L2 Cache
1333 MHz front-side bus
Core™ 2 Extreme is made for enthusiasts and people who love to overclock.

Intel Core™ i7-870 and Core™ i7-860, and Core™ i5-750 processor series are the Nehalem-generation processors that will launch world-wide on September 8th, 2009. All processors support Intel® Turbo Boost Technology. Additionally, the Intel Core™ i7 processors have Intel® Hyper-Threading Technology for 8 threads of performance. See chart below for more details.

Processor Details:

Processor Number	Base Clock Speed (GHz)	Turbo Frequency (GHz)	Cores/Threads	Cache	1K unit Price	Intel Hyper-Threading Technology?	TDP
Intel® Core™ i7-870	2.93	Up To 3.6 GHz	4/8	8 MB	$562	Yes	95 W
Intel® Core™ i7-860	2.80	Up To 3.46 GHz	4/8	8 MB	$284	Yes	95 W
Intel® Core™ i5-750	2.66	Up To 3.2 GHz	4/4	8 MB	$196	No	95 W
Xeon™ X3470	2.93	Up To 3.6 GHz	4/8	8 MB	$589	Yes	95 W
Xeon™ X3460	2.80	Up To 3.46 GHz	4/8	8 MB	$316	Yes	95 W
Xeon™ X3450	2.66	Up To 3.2 GHz	4/8	8 MB	$241	Yes	95 W
Xeon™ X3440	2.53	Up To 2.93 GHz	4/8	8 MB	$215	Yes	95 W
Xeon™ X3430	2.40	Up To 2.8 GHz	4/4	8 MB	$189	No	95 W
Xeon™ L3426	1.86	Up To 3.2 GHz	4/8	8 MB	$284	Yes	45 W

¹ 45nm product is manufactured on a lead-free process. Lead is below 1000 PPM per EU RoHS directive (2002/95/EC, Annex A). Some EU RoHS exemptions for lead may apply to other components used in the product package. Applies only to halogenated flame retardants and PVC in components. Halogens are below 900 PPM bromine and 900 PPM chlorine.

² Performance tests and ratings are measured using specific systems and/or components and reflect approximate performance of Intel products as measured by those tests. Any difference in system hardware, software, or configuration may affect actual performance. Buyers should consult other sources of information to evaluate performance of systems or components they are considering purchasing. For more information on performance tests and performance of Intel products, visit www.intel.com/performance/resources/limits.htm

Intel Core™ i7-800 and i5-700 series processors will have higher performance than the previous generation Intel® Core™2 Quad processors in the same segments. Compared to last year’s Penryn-based mainstream solutions (Intel® Core™ Q9650 processor-based platform) expect 40% better SPECint* rate_base 2006 performance.

Intel® Turbo Boost Technology gives maximum performance to applications that need it most. Smoother and more realistic gaming is achieved by distributing AI, physics, and rendering across up to 8 threads with Intel® Hyper-Threading Technology. Also, Intel® Smart Cache1 provides a higher-performance, more efficient cache subsystem, optimizing performance on multi-threaded applications

The Intel® 5 Series Chipset Family is Intel’s next generation chipset supporting Intel Core™ i7-800 and i5-700 processor series and future 32nm Clarkdale processors. The Intel 5 Series Chipset Family is based on a new single chip architecture that replaces the traditional two chip solution. The Intel® P55 Express Chipset is the first SKU of the Intel 5 Series Chipset family that will be introduced with Intel Core i7-800 and i5-700 processor series.

We are assessing Braidwood schedules but at this time we don’t have an announcement to make.

The Intel Xeon processor 3400 series supports entry-level single processor server system configurations. The silicon supports four integrated cores with up to 8 threads, 8M of Intel® Smart Cache memory, Intel® Turbo Boost technology, an integrated memory controller supporting up to 2 channels of up to DDR3 1333, with core processor frequencies of up to 2.93 GHz. Server processor configurations will support power levels of 95W TDP for the X3400 series and as low as 45W TDP for the L3426. These processors also support up to four Unbuffered DIMMs or up to six Registered DIMMs with a capacity of 16GB for UDIMMs and 32GB of RDIMMs.

We expect multiple vendors to begin offering systems starting September 8, 2009. We expect over 30 platforms from major OEMs, local OEMs, channel and ODMs globally to ramp over the course of 2009 globally. Intel® has already shipped thousands of Xeon™ processors 3400 series to manufacturers in order to enable a rapid platform transition. Intel will also be offering resellers several boards, chassis, and systems based on this platform, available starting September 8th: Intel® Server Board S3420GP, Intel® Server System SR1630GP/HGP, and Intel® Server Chassis SC5650UP. More information on these products can be found at www.intel.com/reseller.

The Intel® 3400 and 3420 chipsets support the Xeon processor 3400 series for entry one-socket server platforms.