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Intel Developer Forum |
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September 18-20, 2007 | San Francisco | Moscone Center West |
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Technology Topics |
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Your IDF pass gives you access to the latest information in several technology areas. What you see, share, and learn will inspire you to take technology beyond where it is today.
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| Mobile and Ultra-Mobile – Experiences Everywhere |
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Consumers in our ever expanding mobile world demand hardware and software solutions that enable them to remain connected to content and people without interruption. IDF is filled with critical information that enables you to transform the lives of users and feed their insatiable desire for uninterrupted connectivity. From the advent of Mobile Internet Devices (MIDs) to the Ultra Mobile PC to updates on WiMAX* and the latest details on extending battery life, if your job is to make the world more mobile, you need to park yourself at IDF.
Mobile and Ultra-Mobile Experiences at IDF:
MPGS001 – Mobile Platform Vision
Speaker: Mike Trainor, chief mobile technology evangelist, Intel Corporation, will provide updates from the Mobile Platforms Group.
MWGS002 – PC Platform Design: Wireless Communications – Preparing for WiMAX*
Speaker: Prakash Kripalani, Customer Application Engineer, Intel Corporation
UMGC001 – Designing for Ultra Mobile Platforms – Chalk Talk
| Speakers: | Pankaj Kedia, Director, Global Ecosystem Programs, Intel Corporation |
| | Joel Medlock, Systems Engineer, Intel Corporation |
| | Dan Monahan, Internet Segment Manager, Ultra Mobility Group, Intel Corporation |
| | Dominik Schmidt, Director, Wireless Engineering, Ultra Mobility Group, Intel Corporation |
| | Dr. Shreekant (Ticky) Thakkar, Chief Platform Architect, Ultra Mobile Platform Group, Intel Corporation |
UMGP001 – Delivering Full Internet in Your Pocket: Software Experience for Mobile Internet Devices – Panel
Moderator: Shane Wall, Vice President of the Mobility Group and Director of Ultra Mobility Business Planning, Architecture and Software, Intel Corporation
Come listen to a panel of software industry vanguards discuss the challenges in delivering a smooth Internet experience on small devices.
UMGS001 – Ultra Mobile Platforms: Vision and Overview
Get the latest on the 2008 MID market segment from Dr. Shreekant (Ticky) Thakkar, Chief Platform Architect, Ultra Mobile Platform Group, Intel Corporation
UMGS004 – Delivering Wireless Connected Ultra Mobile Platforms
Speaker: Dominik Schmidt, Director, Wireless Engineering, Ultra Mobility Group, Intel Corporation
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| Graphics and Gaming – Experience the Extreme |
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Mind-blowing performance. Breathtaking graphics. Realer than real audio. Just three mandatories you need to build into your gaming projects in order to score big with the incredibly demanding gaming world. Come to IDF to gear up on the latest technology information that enables you to blow away consumers. From details on the recently introduced Intel® Core™ Extreme mobile dual-core processor – the world’s highest performing mobile processor1 – to the latest information on media-rich Intel® Graphics to stats on performance-rich technologies built-in to Intel® processors, the information you need to set a new high score for yourself and your company is at IDF.
Graphics and Gaming experiences at IDF:
DHGS004 – Take Extreme Gaming to the Next Level with Intel Gaming Platforms
| Speakers: | Erik Cubbage, Senior Product Marketing Engineer, Intel Corporation |
| | Louis Kaneshiro, Kingston Technologies Corporation |
IGRS001 – Platform Optimizations for Gaming with Intel® Integrated Graphics
Speaker: Patrick Smith, 3D Graphics Technologist, Intel Corporation
IGRS002 – Optimizing High-Definition Playback with Intel® Graphics
Speaker: Satish Ramanathan, Graphics Software Applications Engineer, Intel Corporation
MPGS003 – Extreme Edition Gaming – Notebook Design Considerations for the Enthusiast Gamer
| Speakers: | Dan Ragland, Mobile Platform Engineer, Intel Corporation |
| | Rajiv Mongia, Team Leader, MPG Thermal Technology Development, Intel Corporation |
1 Performance measured on Intel® Core™2 Extreme mobile processor X7800 running SPECint*_base2006. Actual performance may vary. See www.intel.com/performance for more information. SPEC, SPECint, SPECfp, and SPECrate are trademarks of the Standard Performance Evaluation Corporation. For more information about SPEC benchmarks, see: www.spec.org.
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| Intel® Core™ Technology – The Power of Parallel |
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It is an unwavering constant: The demand of business and consumers for higher performing, smaller, more powerful mobile devices; longer battery life; quieter desktop PCs; greater performance per watt; and lower cooling costs. People want increased productivity, security, multitasking, data protection, game performance, and more from their clients and their laptops. At IDF you get critical details and insights on Intel® Core™ processors that enable you to develop innovations that meet today’s ever-changing demands and lay the groundwork for satisfying tomorrow’s. Whatever they may be.
Intel Core Technology experiences at IDF:
Buckle Up: It is Penryn Inside!
Tuesday, September 18, 2007
2:00 p.m.–2:50 p.m.
| Speakers: | Stephen S. Pawlowski, Intel Senior Fellow, Digital Enterprise Group; Chief Technology Officer, Digital Enterprise Group; General Manager, Architecture and Planning, Intel Corporation |
| | Ofri Wechsler, Intel Fellow, Mobility Group; Director, Mobility Microprocessor Architecture, Intel Corporation |
DPTS001 – Inside the Intel® Core™ Microarchitecture and Beyond
Speaker: Stephen Thomas, Desktop Processor Technical Marketing Manager, Intel Corporation
IPTC001 – 45nm Next-Generation Intel® Core™ Microarchitecture (Penryn) Architecture and Intel® SSE4 – Chalk Talk
| Speakers: | Stephen Fischer, Senior Principal Engineer, Intel Corporation |
| | Karthik Krishnan, Senior Software Engineer, Intel Corporation |
| | Kiefer Kuah, Software Engineer, Intel Corporation |
IPTS001 – Technical Overview of the 45nm Next-Generation Intel® Core™ Microarchitecture (Penryn)
Speaker: Stephen Fischer, Senior Principal Engineer, Intel Corporation
IPTS002 – Tuning for Intel® SSE4 on the 45nm Next-Generation Intel® Core™ Microarchitecture
| Speakers: | Karthik Krishnan, Senior Software Engineer, Intel Corporation |
| | Jeremy Saldate, Senior Technical Marketing Engineer, Intel Corporation |
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| Energy-Efficient Performance – Unprecedented Performance. Unmatched Efficiency. |
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Are you developing green? Come to IDF for insights and details on technology that enables you to increase energy efficiency and deliver unprecedented performance. Intel® Core™ microarchitecture is the foundation for many new solutions and form factors that are transforming the performance/efficiency equation.
At IDF, you get information on energy efficiency that enables you to develop the next server that saves business even more money by lowering energy costs and reducing footprints while increasing productivity, details that help you increase battery life and improve performance for mobile devices, and insights that help you develop the next wave of entertainment technologies for consumers. Increase the energy efficiency and performance of your projects. Learn how at IDF.
Energy-Efficient Performance experiences at IDF:
DPTS004 – Using Intel® CPUs to Build Lower Cost, Energy-Efficient, Small-Form-Factor Systems
Speaker: James Cole, Strategic Planning and Marketing, Digital Enterprise Group, Intel Corporation
DPTS005 – Energy-Efficient Performance 2.0: A Proposed Measurement Approach
Speaker: David Salvator, Worldwide Client Capability Evangelist, Intel Corporation
PWRS004 – Energy Efficiency and Building Energy Star*-Compliant Platforms
Speaker: Chris Hamlin, Senior Platform Applications Engineer, Intel Corporation
PWRS005 – Designing Energy-Efficient Motherboards
Speaker: Doug Huard, Principal Engineer, Intel Corporation
PWRS008 – The Green Grid*: Opportunities for Energy Efficiency Innovation in the Power Electronics Industry
Speaker: Tahir Cader, Technical Director at SprayCool and Member of The Green Grid
SPTP001 – Meet The Green Grid* – Panel
| Speakers: | Colette LaForce, Vice President of Marketing at Rackable Systems and Board Member of The Green Grid |
| | Larry Lamers, Senior Engineering Manager at VMware and Board Member of The Green Grid |
| | Tahir Cader, Technical Director at SprayCool and Member of The Green Grid |
TCRS001 – Energy Management Innovations for Future Multi-Core Processors
Speaker: Vivek De, Intel Fellow, Corporate Technology Group; Director, Circuit Technology Research, Intel Corporation
TMWS002 – Energy-Efficient Communication for Mobile Devices
Speaker: Sati Banerjee, Technology Strategist, Intel Corporation
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| Intel® 45nm Hi-k Silicon Technology – Leading the Industry |
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In the second half of 2007, Intel will begin production of the next-generation Intel® Core™2 and Intel® Xeon® processor families codenamed "Penryn" which are based on our industry-leading 45-nanometer (nm) Hi-k + metal gate process technology and latest microarchitecture enhancements.
Come to IDF to discover how this industry-leading process technology opens up a new world of innovation opportunities.
This evolution in Intel® Core™ microarchitecture builds on the tremendous success of our revolutionary microarchitecture (currently used in both the Intel Xeon and Intel Core 2 processor families) and marks the next step in Intel's rapid cadence of delivering a new process technology with an enhanced microarchitecture or an entirely new microarchitecture every year.
With more than 400 million transistors for dual-core processors and more than 800 million for quad-core, the 45nm Penryn family introduces new microarchitecture features for greater performance at a given frequency, plus expanded power management capabilities for new levels of energy efficiency. The 45nm Hi-k next-generation Intel Core 2 and Intel Xeon processors have about 30 percent more transistors but are about 30 percent smaller in silicon area than Intel's current 65nm products and operate at the same or lower power than the current Intel Core 2 processors.
Check this site often for a complete list of 45nm Hi-k silicon technology experiences at IDF.
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Intel reserves the right to make changes and adjustments in content and schedule of the Intel Developer Forum.
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