"Microelectronics assembly and packaging technology" or "Packaging" is a key element to Intel manufacturing and product development. Much of the skill set needed to understand and excel with the latest packaging technology requires a multi-disciplinary background of Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering and Industrial Engineering. Identifying the core elements of these disciplines, combining them into a base skill set and then fine tuning the specific skills required for actual packaging manufacturing can be a missing element in a university's technical curriculum.
Intel Corporation and Fulton School of Engineering, Arizona State University (ASU) have collaborated on this topic to identify the key skills sets and knowledge needed to cover a packaging curriculum addressing this multi-disciplinary concern. ASU is creating the following suite of courses to cover these areas and will be sharing them on the Intel Higher Education Curriculum Forum website in the coming months. This course has been developed as a two year master’s level course. The first year program focuses at “leveling” incoming skills to produce a standard skill set. The second year focuses then on the specific “packaging” skill sets needed in the semiconductor industry.
The courses' topics focus on the microelectronics assembly and packaging technology area, and are designed to be appropriate for students and professionals from a wide range of engineering backgrounds. These courses are address the microelectronics market's need for more detailed training in the assembly and packaging areas.
The first year courses are currently expanded below with the second year courses under development.
|
Engineering Department |
LEVELING course number |
LEVELING Course Title/Description |
|
Electrical |
EEE498 |
Overview of Electrical
Engineering for Non-EEs: This course serves as a
leveling course in introducing Electromagnetic Field Theory, Review of Circuit
Theory, Transmission Line Theory, Electrical Network Theory, Review of
Communications Theory, Electromagnetic Interference and Compatibility,
Computational Techniques and Electromagnetic Software. Course Objective is for
non-EE students become familiar with fundamental electrical engineering
concepts enabling their further study of advanced courses in electrical
packaging.
|
Mechanical |
MAE498 |
Overview course in
Mechanical Engineering: This course's objective is
to give students in different engineering programs, a good foundation on the
basic principles of mechanical engineering. This course will teach student's
mechanical engineering fundamentals needed for advanced electronic packaging
courses. Students will be taught basics of statics and mechanics of materials.
The bulk of the course will be devoted to introductory mechanics topics.
Practical applications are included in different sections to give the student a
glimpse of how the material being taught is used in the packaging industry. The
course is meant to be accessible to engineering students and practicing
engineers in any field, who have a good foundation in physics and mathematics.
|
Thermal |
MAE598 |
Overview of Heat Transfer: This course serves as
the leveling course for heat transfer in electronics packaging, and also offers
an introduction to various heat transfer mechanisms and analyses for
engineering students who are not thermofluid majors. Discusses fundamentals and
applications of conductive, convective, radiative, phase-change, and
combined-mode heat transfer. Emphasizes the modeling of thermal systems,
including heat exchangers, and provides an introduction to the cooling of
electronic equipment. |
Materials Science/ Chemical Engineering |
MSE498 |
Overview of Materials Engineering for non-MatEs: This
course examines relationships among structure, phases and properties of
materials processed under equilibrium and non-equilibrium conditions. The scope
of this course includes metals, polymers, semiconductors, and ceramics. The
student will be introduced to physical and mechanical properties and
metrologies used to measure those properties Course Outcomes: After completing
this course the student will 1) Have a working knowledge of structure, phases
and properties of materials processed under equilibrium and non-equilibrium
conditions 2) Have a working knowledge of physical and mechanical properties
and metrologies used to measure those properties 3) Build empirical, regression
models from data to relate input and output variables 4) Plan, design, conduct,
and analyze experiments efficiently and effectively for semiconductor processes
5) Assess process control and capability and develop and use basic control
charts for semiconductor processes 6) Computer software for hands-on analysis
is fully integrated into the course and used for assignments and projects. |
Industrial Engineering/ Statistics/ Manufacturing |
IEE598 |
Introduction to Designed Experiments, Statistical Process Control, and
Statistical Reasoning: This is a course in design
of experiments, statistical process control, and introductory statistical
analysis that focuses on improvements to semiconductor processing and
packaging. It is intended for engineers, managers, and physical/chemical
scientists. Methods and examples are focused on semiconductor development and
manufacturing. Computer software is integrated for hands-on analysis throughout
the course. Methods presented can be directly applied in all phases of
engineering work, including new product design and development, process
development, and manufacturing process improvement. Course objectives: 1)
Interpret data graphically and numerically, compute basic probabilities and use
common probability distributions 2) Analysis methods to compare processes with
hypothesis tests, confidence intervals, and ANOVA 3) Build empirical,
regression models from data to relate input and output variables 4) Plan,
design, conduct, and analyze experiments efficiently and effectively for
semiconductor processes 5) Assess process control and capability and develop
and use basic control charts for semiconductor processes 6) Computer software
for hands-on analysis is fully integrated into the course and used for
assignments and projects. |
Phase 2 Courses - Advanced Topics – Courses Currently under development
Engineering Department |
ADVANCED course number |
ADVANCED Course Title/Description |
Electrical |
EEE601 |
Advanced Package Analysis & Design: Electrical Considerations:
Electrical Functions of the Package, Overview of Power Delivery Issues, Signal
Integrity Overview, EMI/EMC and ESD considerations. Course is intended to
expose students to the key electrical design and analysis issues in
microelectronic packaging. |
Mechanical |
MAE601 |
Advanced Package Analysis & Design: Mechanical Considerations: The
objective of this course is to expose students to the mechanical aspects of
electronic packaging. Stresses induced in an electronic package during assembly
and operation, and the numerical and experimental stress analysis techniques
used to study these stresses are covered in detail. The majority of the course
content is derived from continuum mechanics and advanced mechanics of materials
concepts, and illustrated with practical applications in the electronic
packaging industry. Published literature will be used to highlight current
analysis techniques in the industry. Some of the topics being covered include:
solder joint creep and thermal fatigue, CTE mismatch induced stresses in
multilayer composites, and a brief overview of vibration analysis used in the
electronic packaging industry. Students will also be exposed to typical finite
element analysis techniques used to study electronic packages, and the
experimental validation techniques employed. The course is meant to be
accessible to engineering students and practicing engineers in any field, who
have a good foundation in basic mechanics of materials.
|
Thermal |
MAE602 |
Advanced Thermal Packaging: is a new course whose objective is to
demonstrate the application of fundamental heat transfer principles to the
solution of thermal cooling problems in electronics packaging. The course will
consist of a series of lectures to introduce and develop the fundamental
concepts of conduction, convection, radiation and two-phase heat transfer. Case
studies will be used to allow students to work on application of these
principles to real-life thermal packaging solutions. The course is meant to be
accessible to graduate students in mechanical engineering, materials science,
and to practicing engineers. |
Materials Science/ Chemical Engineering |
MSE601 |
Advanced Packaging Analysis & Design: MATERIAL Considerations: This
course will acquaint students with materials used for packaging integrated
circuits (IC's). The scope of this course includes the purpose, formulation,
and chemistry of materials used for IC packaging. The student will be
introduced to metrologies and physics used to characterize material properties
important for IC packaging. This course will cover the material property
requirements for processing, device performance, and reliability performance.
Finally, the course illustrates how the fundamental principles learned in class
are used in materials selection and design. After completing this course the
student will 1) Understand the purpose, formulation basics, chemistry, and key
properties of packaging materials 2) Have a working knowledge of the use of
advanced metrologies and fundamental physics to characterize material
properties important for IC packaging 3) Be able to integrate processing
requirements for packaging materials 4) Be able to apply these concepts to
synthesize key material property requirements for a new packaging application
5) Be able to design and select materials based on those material property
requirements.
|
Industrial Engineering/ Statistics/ Manufacturing |
IEE599 |
Advanced Analysis Methods: This course presents advanced methods and
tools that are critical for the analysis of semiconductor and packaging design
and manufacturing. It is intended for engineers, managers, and
physical/chemical scientists. Methods and examples are focused on semiconductor
development and manufacturing. Computer software is integrated for hands-on
analysis throughout the course. Opportunities to use the principles taught in
the course arise in all phases of engineering work, including new product
design and development, process development, and manufacturing process
improvement. Course Objectives: 1) Experimental designs for semiconductor and
packaging development and manufacturing analysis. These include response
surface designs, experiments for computer simulations and models, and robust
designs that integrate noise factors. 2) Measurement capability analysis for
measurement system development and characterization, components of variance
analysis 3) Process characterization and capability analysis 4) Introduction to
statistical tolerance analysis and simulation methods, applications of joint
probability distributions 5) Additional topics based on class interest might
include advanced methods for statistical process control, introduction to
multivariate methods, advanced regression analysis, or data mining methods 6)
Computer software for hands-on analysis is fully integrated into the course and
used for assignments and projects Background: An introductory course in
statistical methods such as IEE 498 or the equivalent.
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