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Quality and Reliability Resources
Intel quality and reliability documentation
- ISO registrations
Intel uses the ISO 9001:2000 International Standard as the baseline for our quality system. All of Intel's mature manufacturing wafer fabrication, assembly/test sites, and logistics centers are registered to ISO 9001:2000 by a third-party registrar.
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Manufacturing enabling collateral
File type/Size: PDF 69KB
Learn how to register to search, view, and download manufacturing enabling collateral for Intel® technologies.
- Material Declaration Data Sheets (MDDS)
Search, view, and download Material Declaration Data Sheets for Intel® products.
- Product Change Notifications (PCN)
Search, view, and download Product Change Notifications, including Product Discontinuance Notifications, for Intel products.
- Product regulations
View product regulations (Declarations of Conformity).
- Regulatory certificates for Intel products
View regulatory certifications for Intel product compliance with international importation directives and procedures.
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Manufacturing with Intel® Weybridge Platform (also know as Bearlake Platform) MAS
File type/Size: PDF 760KB
Intel® Core™2 Duo Processor interfacing with the motherboard via a (Land Grid Array) LGA775 socket. Intel® 3-Series Chipset Family ATX, μATX, BTX, μBTX, and pBTX board form factors
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Manufacturing with the Intel® Tylersburg Platform
File type/Size: PDF 4.64MB
Tylersburg High-end desktop (HEDT) platform will use a new LGA1366 socket with backplate for Intel® Core™ i7 (previously Bloomfield) processor.
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Land Grid Array (LGA) Socket and Package Technology: Handling, Inspection, and Integration Module
File type/Size: PDF 1.67MB
The enabling documentation focuses on key learnings from Intel reference process development.
Intel quality and reliability videos
- Intel® Itanium® processor assembly handling recommendations
LGA1248 video uses the Tukwila CPU, and enabled components and processes demonstrated will include assembly, disassembly, field upgrade and inspection.
- Manufacturing with Intel® components strain measurement for circuit board assembly: vishay strain gage
This video demonstration will outline the proper method to attach strain gages to the primary side of boards for Intel Ball-Grid-Array packages and using the Plan-Of-Record location. These are used to measure transient bending or flexure which may be induced along the assembly line during the manufacturing process.
- Manufacturing with Intel® components strain measurement for circuit board assembly: kyowa strain gage
This video demonstration will outline the proper method to attach strain gages to the primary side of boards for Intel Ball-Grid-Array packages and using the Plan-Of-Record location. These are used to measure transient bending or flexure which may be induced along the assembly line during the manufacturing process.
- Handling recommendations
This video showcases the best practices for setting safe, efficient handling standards; incorporating methods and practices that ensure consistent quality and minimize defects and accidents.
- Electro-static discharge methods
This video provides an overview of Intel's prevention methods of ESD, device models and theory. It applies case studies related to equipment qualification requirements for ESD compliance.
- LGA1366 socket and package assembling
This video discusses procedures to assemble the LGA1366 Independent Loading Mechanism or ILM and heatsink.
- Manufacturing methods - Unit Level Traceability auto strap
This video provides an overview of Intel's Unit Level Traceability (ULT) system, a technology developed to address the complexities that exist with the introduction of new manufacturing technologies in Assembly/Test in Intel. Video playing time is 4 minutes.
- BGA rework recommendations
This video provides an overview of Intel's rework method for chipset and processor sockets in a BGA package.
- Intel® Processor Assy-LGA1156 Socket
This video describes procedures to install and remove all Intel® processors in the LGA1156 Socket.
- LGA1156 Socket & Processor Assembly
This video describes procedures to assemble the LGA1156 Socket Independent Loading Mechanism, or ILM, for all Intel® processors in the 1156-land LGA package family.
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Manufacturing with the Intel® Products: Intermediate-Box (I-Box, IBox) Handling Recommendations
File type/Size: PDF 2255KB
Intel® products are shipped using 2-box* packaging in general. This enabling documentation outlines the importance of proper handling.