- Home›
- Hardware Design›
- Quality & Reliability ›
- Discover Manufacturing Enabling›
- Intel® Manufacturing Enabling Guide
Intel® Manufacturing Enabling Guide
Purpose of the Manufacturing Enabling Guide
The Intel® Manufacturing Enabling Guide serves as a data reference for customers using Intel components in their products. Each chapter provides information with respect to a certain aspect of the use or characteristics of Intel components.
The information provided is meant to be generic in nature. Product specific packaging information can be found in the product's technical documents. To learn more about specific Intel products click here.
Chapter 1:
-
Component Surface Mount Technology (SMT)
File Type/Size: PDF 152KB
A review of the mass reflow soldering technologies of printed circuit board (PCB) component assembly termed SMT (surface mount technology).
Chapter 2:
-
SMT Board Assembly Recommendations
File Type/Size: PDF 893KB
Suggested process parameters for Pb-free SMT board assembly reflow and rework.
Chapter 3:
-
ESD / EOS
File Type/Size: PDF 118KB
An overview of electrostatic discharge and electrical overstress.
Chapter 4:
-
Board Flexure Initiative (BFI)
File Type/Size: PDF 1.79MB
BFI definition, detection methods and strategies to minimize effects.
Chapter 5:
-
Transport Media, Packing and Moisture Sensitivity
File Type/Size: PDF 255KB
Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, moisture sensitivity concerns/specifications, and shipping data are illustrated.
Chapter 6:
-
Additional Information Sources
File Type/Size: PDF 164KB
A reference to more detailed information on the topics covered in this Manufacturing Enabling Guide available on the Intel Learning Network.
back to top