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Non-Destructive Testing 2
Time Domain Reflectometry
Time Domain Reflectometry is a method used to measure the electrical impedance of metal traces. A short, high-frequency pulse is generated and transmitted from the pad, pin, or ball through the metal traces of the package and into the die. Any impedance changes will cause reflections that are characteristic for the impedance change. During functional analysis, the location information of the impedance change can be used to isolate the origin of opens or shorts.
Thermal Imaging
During Thermal Imaging, the electromagnetic emissions in the near-infrared range are collected and processed to produce a thermal emission map of the device. Through comparison with reference parts, hot spots can be identified that relate, for example, to mismatches in thermal conductivity.
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