AP-914 Pentium® III Xeon® Processor SMBus Thermal Reference
The Pentium® III Xeon® processor is
housed in a Single Edge Contact (S.E.C.) cartridge. Intel has included a
thermal sensor inside the Pentium III Xeon
processor to aid in thermal management of server and workstation
systems. This feature allows for flexibility and precision in thermal
management applications. The thermal sensor is connected to a thermal
diode on the processor core. The core is the most significant source of
power dissipation in the cartridge. The thermal diode temperature
changes very closely with the junction temperature. Thus, the thermal
sensor provides the earliest indication of thermal variation and the onset
of potential thermal solution failure. Note that the maximum thermal plate
specification remains the governing condition for guaranteed operation of
the processor. For some applications the cache may be the forcing
function of the thermal plate temperature if the core is not being exercised
in high power mode. The thermal diode is located on the processor core
and does not monitor the cache temperature.
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