Intel® Pentium® III processor Thermal Metrology for CPUID 068h family processors

This document describes the procedure for measuring the core junction temperature on Intel® Pentium® III (068xh family) processors in the following form factors: Single Edge Connector Cartridge 2 (SECC2) or the Flip Chip Plastic Grid Array (FCPGA). The metrology involves use of the High Power Application software Rev 1.0 ("HIPWR30.EXE") to perform system level analysis of cooling solutions. Using the methodologies described in this document, a system designer will be able to validate system-cooling solutions for compatibility with the specified processor worst-case power consumption.

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