AP-905 Pentium® III Processor Thermal Design Guidelines
In a system environment, the processorís temperature is a function of both the system and
component thermal characteristics. The system level thermal constraints consist of the local
ambient temperature at the processor and the airflow over the processor(s) as well as the physical
constraints at and above the processor(s). The processor temperature, measured at various points,
depends on the component power dissipation, cartridge size and material (effective thermal
conductivity), the type of interconnection to the substrate, the presence of a thermal cooling
solution, the thermal conductivity, and the power density of the substrate.