Single Edge Contact Connector 2 (S.E.C.C. 2) Thermal Interface Material Functional Requirements

The purpose of the Thermal Interface Material Functional Specification is to provide the design constraints and requirements for the thermal interface between the Single Edge Contact Cartridge 2 (S.E.C.C. 2) and heat sink to comply with S.E.C.C. 2 performance requirements set by Intel. This includes environmental testing outlined in Support Component Test Requirements. These constraints are compatible with the Heat Sink and Heat Sink Attachment Functional Requirements for S.E.C.C. 2. If the heat sink and S.E.C.C. 2 are not properly attached to one another, the quality of the thermal interface may degrade, possibly causing damage to the S.E.C.C. 2 processor or core package.

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