|
Intel® Socket Test Technology for the LGA775 Socket
Portuguese VersionIntel® Socket Test Technology for LGA775 has been developed to provide solder-joint and pin contact coverage for LGA775 sockets that have been assembled onto motherboards. This integrated silicon technology dramatically improves coverage (up to 90%), and enables motherboard makers to improve overall product quality and assembly process performance. This document includes the theory on which Intel® Socket Test Technology is based, typical test methods (powered and un-powered), and device specifications. NOTE: The most current information is rolled into the English version first. Please check document revision numbers on the PDF file to check synchronization status of the documents.
|