Intel has developed a unique optoelectronic assembly platform that integrates micro-optics, lasers, and high-speed electronic components in high-performance, miniaturized modules. Intel's optoelectronics addresses three important enablers for next generation, high bandwidth fiber optics equipment:
Higher speeds
Higher optoelectronic integration levels
Scalable, automated, low cost manufacturing
Intel has also developed the capability to integrate optics and high-speed electronics into full-featured optical-to-electrical conversion solutions for our optical networking equipment customers.
Micro-Optics Design
Intel's transmitter and receiver modules are based on a novel quasi-planar optoelectronic design. The modules are designed specifically for high-speed (10Gbps and up) data rates, and due to their high level of integration, combine more optical and electronic functionality in a much smaller footprint than conventional transmitters and receivers.
The assembly process occurs in three steps:
Step 1 Creation of multi-layered co-fired ceramic substrate
Step 2 Component place (e.g. laser diode or high-speed driver) by automated pick-and-place assembly
Step 3 Automated (active mode) alignment of active elements and optical fiber
Optical components such as lenses and fibers are mounted on micro-machined metallic flexures, then picked and placed on the metallized platform, actively aligned and welded in place by a custom designed automated welding machine. The modular platform can be packaged in standard hermetically sealed butterfly can packages or customized miniature form factors.
Intel has created an automated assembly equipment designed specifically to work with the unique quasi-planar optical package.
Optoelectronics Technology
