| Intel XScale® core available at 266, 400, and 533 MHz |
Delivers high MIPS/power consumption ratio and provides ample processing headroom for value-added software features |
| 32-bit 33/66 MHz PCI v2.2-compatible, host and option interface |
Provides flexibility to directly connect devices including 802.11x chips, PCMCIA controllers, and cable MAC/PHYs |
 |
USB v1.1 device controller |
 |
USB v2.0 host controller, supports low-speed and full-speed modes only |
|
Industry-standard interface for connection to a wide array of devices |
| 32-bit, DDR1-266 SDRAM interface for 32 MByte to 1 GByte of memory |
High-bandwidth memory interface |
32-bit expansion bus interface with parity
 |
Master/Target capable |
 |
25-bit address |
|
 |
Glueless connection to other devices |
 |
External mastering capability allows external devices to communicate with each other and with internal peripherals resulting in shared memory subsystem design and lower system cost |
|
| Up to three integrated 10/100 Ethernet MACs with MII interface |
 |
Industry-standard networking interface |
 |
Multiple ports allow lower system cost, multiple LAN port support, and concatenation of networking modules |
|
| UTOPIA-2 interface with multiple ADSL/G.SHDSL or VDSL PHY support |
Industry-standard WAN interface |
| Two High-Speed Serial (HSS) ports for connecting to T1/E1 or SLIC/CODEC |
Connects to T1/E1 or SLIC/CODEC for voice support |
| Silicon functional assistance for Random Number Generation |
Accelerates public key exchange, authentication and key generation |
| Integrated hardware support for popular cryptography algorithms |
Acceleration for popular applications such as IPSec and SSL VPNs (AES/ AES-CCM/ 3DES/ DES /SHA-1 /SHA-256 /SHA-384 /SHA-512 /MD-5 /RSA /DSA /Diffie-Hellman algorithms) |
| Two high-speed UARTs support up to 921 Kbaud each |
Provides an interface for debug and passing control information |
| Integrated I2C and SSP interfaces |
Provides serial interface for common embedded and communications application; reduces system BOM |
| Spread-spectrum clocking |
Improves system reliability by reducing EMI |
| Comprehensive pre-validated, pre-integrated "out-of-the-box"
development infrastructures ready for application development using Linux* and VxWorks* |
Ease of design and fast time-to-market |
544-ball PBGA package
 |
35 mm x 35 mm, 1.27 mm ball pitch |
 |
Lead-free packages available |
 |
Commercial temperature (0° to 70° C) |
 |
Extended temperature (–40° to 85° C) |
|
 |
High-performance package provides improved reliability |
 |
Lead-free packages help meet environmental regulations |
 |
Extended temperature support for industrial control and automation applications |
|