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Boards and Platforms
Designed for AdvancedTCA* Specifications
 
Intel is providing leadership for future generations of communications solutions with a family of products compliant with the PICMG* 3.x specification. All components are designed to be NEBS-3/ETSI-compliant and feature IPMI v1.5-based management. Learn more about the performance, flexibility and backplane interconnect bandwidth now available with modular, standards-based building blocks below.
 
 
 
Related information
 

Single board computers
Product Processor Core Chipset Mezzanine Slots RTM
MPCBL0001+ Dual Low Voltage Intel® Xeon® processors (2.0 GHz) Single Intel® E7501 1 PMC No
MPCBL0020+ Intel® Pentium® M processor 760 (2.0 GHz) Single Intel E7520 3 PMC MPRTM0020
MPCBL0030 Dual Low Voltage Intel® Xeon® processors (2.8 GHz) Single Intel E7520 1 PMC No
MPCBL0040+ Dual Dual-Core Intel® Xeon® processors LV 2.0 GHz processors Dual Intel E7520 1 AdvancedMC MPRTM0040
MPCBL0050+ Dual Dual-Core Intel® Xeon® processors LV 5138 (2.13 GHz) Dual Intel® 5000P 1 AdvancedMC MPRTM0050

 
Chassis
Product Description Height Node Slots Number of Fans Power/Slot Chassis Management
MPCHC0001+ 14U Shelf 24.4 in (61.98 cm) 14 6 200 W MPCMM0001

 
Chassis management module
Product Compatibility Size Function
MPCMM0001+ MPCBL0001
MPCHC0001
5.69 in (14.45 cm) PCB x 4HP Monitors chassis resources and environmental conditions; provides instrumentation for health metrics and alerting. Defines the interface between platform hardware and system software to support higher level management interfaces.
MPCMM0002+   5.69 in (14.45 cm) PCB × 3HP Monitors chassis resources and environmental conditions; provides instrumentation for health metrics and alerting. Defines the interface between platform hardware and system software to support higher level management interfaces.

 
TEM is responsible for obtaining NEBS certification.


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