AP 444 - Intel® 82540EP/82541(PI/GI/EI) & 82562EZ(EX) Dual Footprint Design Guide Application Note
Intel currently supports several "footprint compatible" Ethernet options depending upon the target
application. The term "footprint compatible" means that the silicon devices are all manufactured in
a 15mm x 15mm, 196-ball grid array package, with the same ball pattern. Many of the critical
signal pin locations are identical, allowing designers to create a single LAN on Motherboard
(LOM) design that accommodates all the devices. This is a flexible, cost-effective, multipurpose
design technique. You can maximize value while matching your customers' performance needs.
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