Intel® 82562EZ(EX)/82547GI(EI) Dual Footprint Design Guide Application Note
The 82562EZ(EX)/82547GI(EI) platforms support several "footprint compatible" Ethernet options depending upon the target application. The term "footprint compatible" means the silicon
devices are all manufactured in a 15mm x 15mm, 196-ball grid array package, with the same ball
pattern. Many of the critical signal pin locations are identical, allowing designers to create a single
LAN on Motherboard (LOM) design that accommodates all the devices. This is a flexible, costeffective,
multipurpose design technique. You can maximize value while matching your customers'
performance needs.
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