| Features |
Benefits
|
| Dual-core with dual-processing capabilities |
Significant performance headroom for multi-threaded applications using up to four high-performance cores per platform. Wireless, voice, storage and medical applications can use the performance and headroom to run parallel tasks such as database, image and voice/data processing.
Reduces image production time and optimizes image quality for medical-imaging applications.
|
| Intel® Core™ microarchitecture |
Improved performance on multiple application types and user environments at a substantially reduced power envelope.
Enhanced energy-efficiency enables equipment manufacturers to optimally balance processing capabilities within power and space constraints.
Intel® Wide Dynamic Execution - Executes four instructions per clock cycle.
Intel® Advanced Smart Cache - Allows each core to access full L2 cache.
Intel® Smart Memory Access - Maximizes main memory-to-CPU bandwidth and reduces latency.
Intel® Advanced Digital Media Boost - Executes 128-bit SSE/2/3 instructions in a single clock cycle.
Intel® Intelligent Power Capability - Manages run-time power consumption of all execution cores.
|
| Extended life product support |
Protects system investment with extended product availability. |
| Ultra dense low-power processors |
Reduced power envelope delivers even higher performance per watt. (LV 5148Δ, LV 5138Δ, and LV 5128Δ)
Reduced power/thermal operating costs and improved data center density.
|
| 4 MB shared L2 cache |
Larger cache, shared by both cores, means allocation can be set dynamically between cores based on application load; significantly reduces actual latency when accessing the most commonly used data.
Increased efficiency of L2 cache-to-processor data transfers maximizes main memory-to-processor bandwidth and reduces latency.
|
| 1333 MHz FSB |
Faster system bus speeds than previous generations.
Faster data transfer between physical memory, I/O and the dual cores for increased throughput.
|
| Intel® Virtualization Technology (Intel® VT)¹ |
Enables migration of more environments - including 64-bit operating systems and applications - to virtual environments on the same hardware.
Diverse operating systems and applications can be consolidated quickly and easily.
Helps reduce cost of server management and hardware migration.
Greater isolation and security between different applications and operating systems for added protection
against corruption.
|
| Intel® Extended Memory 64 Technology³ |
Supports 64-bit instructions with access to larger physical address spaces.
Flexibility for 64-bit and 32-bit applications and operating systems.
Access to larger physical memory space reduces load on the system.
Faster access to data from RAM instead of drive.
|
| Fully Buffered DIMM memory |
Higher bandwidth memory subsystem; enables high-speed memory interface with large capacity.
New memory interface based on standard DDR2 memory.
Greater memory flexibility (quad channel memory subsystem on Intel® 5000P chipset; 4 FB-DIMMs
per channel).
Signal quality and high speed can be maintained no matter how many DIMMs are on the system.
Improved error detection capability; helps prevent address/command soft errors which can disrupt
performance and reliability.
|
| Intel® I/O Acceleration Technology (Intel® I/OAT)² (Intel® 5000P chipset) |
Moves data to and from applications much faster.
Relieves some I/O bottlenecks and frees CPU for other processing tasks to improve network performance.
|
The Intel® Xeon® processor 5100Δ series on 65-nanometer (nm) technology is Intel's newest and most advanced product line of 64-bit dual-core processors, enabling higher levels of performance, power efficiency and reliability for embedded, storage and communications platforms.