Intel® Core™ Duo processor on 65 nm process for Embedded Applications Thermal Design Guide
This document describes thermal design guidelines for the Intel® Core™ Duo processor on 65 nm
process for Embedded Applications in the micro Flip Chip Pin Grid Array (micro-FCPGA)
package and the micro Flip Chip Ball Grid Array (micro-FCBGA) package. Detailed mechanical
and thermal specifications for these processors can be found in the Intel® Core™ Duo processor
and Intel® Core™ Solo processor on 65 nm process Datasheet.
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