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Intel® E7520 Chipset
Overview
 
Block Diagram | Features & Benefits | Product Package

For Embedded Computing
Intel® E7520 Chipset Product Photo The Intel® E7520 chipset, utilizing next-generation dual-processor server chipset technology, enables reduced power consumption, with improved platform reliability and system manageability compared to previous generation server systems. This chipset enables new dual-processor servers to deliver outstanding performance, dependability and value to embedded customers and their applications.
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The Intel® E7520 includes revolutionary PCI Express*1 serial I/O technology and DDR2, the next generation memory technology, to help increase I/O bandwidth and reduce system latency for data-intensive applications. The 800 MHz system bus allows these chipsets to support the Intel® Xeon® processor as well as the Low Voltage Intel® Xeon® processor with 800 MHz system bus with Intel® Extended Memory 64 Technology (Intel® EM64T), Hyper Threading technology, Enhanced Intel SpeedStep® Technology and Streaming SIMD Extensions 3 (SSE3) Instructions.

Intel E7520 chipset-based platforms can be designed to support DDR 266, DDR 333 or DDR2-400. DDR2-400 memory technology is ideal for storage and memory-intensive applications, providing up to 20% increase in memory bandwidth, and up to 40% decrease in power consumption over DDR 333. The memory subsystem interface to the MCH is dual channel, supporting three or four registered DIMMs per channel, depending on memory technology, for a total system bandwidth of up to 6.4 GB/second. The MCH supports up to 16 GB for DDR2-400 memory, up to 32 GB for DDR 266, and up to 24 GB for DDR 333.

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Block Diagram
Intel® E7520 Chipset Diagram
Features and Benefits
Supports two Intel® Xeon® processors as well as Low Voltage Intel® Xeon® processors over an 800 MHz system bus for dual-processing workstation and server systems Optimized performance for multiple DP market segments and price points, supporting a larger number of users/transactions with faster response times. Increased platform bus bandwidth (50% more than 533 MHz) delivers increased system performance a larger number of users/transactions with faster response times
800 MHz system bus capability Increased platform bus bandwidth (50% more than 533MHz) delivers increased system performance
PCI Express*1 Direct connection between the MCH and PCI Express* component/adapters; bandwidth up to 4 GB/second on each PCI Express* x8 interface; higher bandwidth and less I/O bottlenecks than PCI-X
DDR2-400 memory interface
Maximum memory bandwidth of 6.4 GB/second
Decreased power consumption – especially important on dense rack, HPC and blade configurations
Intel® 6700PXH 64-bit PCI hub
Next-generation PCI/PCI-X performance and significant enhancements to platform flexibility
Supports two independent 64-bit, 133MHz PCI-X segments and two hot-plug controllers (one per segment)
Intel® Hub Interface 1.5 connection to the MCH Point-to-point connection between the MCH and the Intel® 6300ESB I/O Controller Hub provides 266 MB/s of bandwidth
Advanced Platform RAS
Features such as memory ECC, Intel® x4 Single Device Data Correction2 (x4 SDDC), DIMM sparring, DIMM scrubbing and memory mirroring3 can improve system reliability
32-bit CRC on PCI Express*
Hot swap PCI Express* enhances serviceability
SMBus port hooks into Intel E7520 chipset for remote management operation and support for variety of third-party BMC (base management controller) and BIOS solutions
Intel® E7520 Chipset for Embedded Computing
Product Package
Intel® E7520 Memory Controller Hub (MCH) 1077 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 6700PXH 64-bit PCI hub 567 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 6300ESB I/O Controller Hub 689 Plastic Ball Grid Array (PBGA)
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