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Intel® 440MX Chipset Overview

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For embedded computing

The Intel® 440MX Chipset represents the latest in chipset integration. By providing a cost effective, low power single-component chipset specifically designed to reduce system cost, space and power, this product is ideal for low power, low cost applied computing platform solutions. The Intel 440MX Chipset offers designers an extremely cost effective way to enable Intel quality, reliability, and initiatives across all their low power market segments.

The Intel 440MX Chipset supports Intel® Celeron® processor – low power and ultra low power and Intel® Pentium® III processor – low power designs. The Intel 440MX Chipset is offered in the small form-factor, 492 Ball Grid Array (BGA) package with a typical power dissipation of 2.1-W making it an effective solution for fanless applications.

The Intel 440MX Chipset provides advanced features like support for USB, ACPI power management, and AC’97 link interface, which enable soft technologies. The chipset is a single-component that integrates the north bridge and the south bridge and an additional AC’97 digital link (2 channels) into one chip. It replaces the ISA interface with an 8-bit X-bus that supports KBC, SIO, and flash memory.

Product highlights

  • Flexible processor support from the Intel Celeron processor – ultra low power at 300 MHz to the Intel Pentium III processor – low power at 700 MHz and beyond with support for 66 or 100 MHz Processor Side Bus (PSB) speeds
  • Offers power management options such as ACPI and Suspend To RAM (STR)
  • Supports highly integrated single chipset combining north and south bridges
  • Lower power small total footprint
  • Based on the Intel® 440BX AGPset core architecture
  • Integrated DRAM controller
  • Supports up to 100 MHz SDRAM
  • 256 MB maximum memory
  • AC’97 host controller
  • Power management
  • PCI revision 2.2 compliant
  • 4 PCI bus masters
  • Integrated IDE controller for ultra DMA/33
  • Integrated USB controller
  • Low cost PCI graphics
  • SMBus interface
  • 492 BGA
  • 3.3-V core and mixed 3.3-V with 5.0-V tolerant and GTL I/O buffers
  • 2.1-W (at 100 MHz) and 1.6-W (at 66 MHz) TDP (typical) power dissipation with low power features enabled

Linecard

Product Product Code Package Features
Intel® 440MX Chipset FW82443MX100 492 BGA
  • Combines the Intel® 440BX AGPset core architecture and PIIX4 south bridge into a single chip
  • Advanced power management features
  • AC’97 link interface based on Intel® AC’97 specification v2.1
  • BOM cost savings


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