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Intel® 845GE/845PE Chipset Thermal Design Guide: Intel® 82845GE GMCH / Intel® 82845PE MCH Thermal and Mechanical Design Guidelines
As the complexity of computer systems increases, so do power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperature of all components in a system is maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component.
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