Direct RDRAM* Thermal Design Methodology Rev 1.0

Determining Plate Temperature based on Die Test Temperature and Device Power

The goal of this document is to establish a methodology that the module vendor can follow to define the maximum allowable plate temperature, based on the following options they have in designing their module:

  1. 1. Device power
  2. 2. Thermal interface material
  3. 3. Module cover (or heat spreader)
  4. 4. Maximum allowable device temperature

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