Intel® 860 Chipset Thermal Considerations Application Note (AP-721)

The goal of this document is to provide an understanding of the operating limits of the Intel® 860 chipset and discuss a generic thermal solution. The objective of thermal management is to ensure that the temperature of all components in a system is maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component.

Related Documents
  • Intel® 82801BA I/O Controller Hub (ICH2) and Intel® 82801BAM I/O Controller Hub (ICH2-M) Datasheet - 290687
  • Intel® 860 Chipset: 82860 Memory Controller Hub (MCH) Datasheet - 290713
  • Intel® Xeon® Processor and Intel® 860 Chipset Platform Design Guide - 298252

File Name/Size:

154679 bytes
Download From:
FTP Server

Web Server (Available for byte serving)