Intel® Boot Block Flash Memory Components
Device Characteristics: 28F002BC


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General information
Device Description 2 Mbit Flash BootBlock Memory
Architecture ETOX-IV™
Die Stepping Revision A
Die Size 195 x 146 Mils
Number of Transistors 2,097,152
ESD Pass Voltage
(mil-883c, m3015)		 +/- 2000 V
Icc Typical
(5v, hot c, no resistive loads)		 20mA @ 10Hz
Icc Max
(5v, hot c, no resistive loads)		 55 mA @ 10 Mhz CMOS 60 mA @ 10 Mhz TTL
Die Bond Pad Dimensions 105 U x 105 U

Process information
Process 627D

Package information
Designator PA
Package Type PSOP
Number of Leads 44
Thermal Impedance (Theta jA) =
(Theta jC) =

Package information

Designator E
Package Type TSOP
Number of Leads 48
Thermal Impedance (Theta jA) = 18.0 C/Watt
(Theta jC) =

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