Intel has updated the definition of the next generation Itanium® processor, code name “Kittson”. Kittson will be manufactured on Intel’s 32-nm process technology and will be socket compatible with the existing Intel Itanium 9300/9500 platforms, providing customers with performance improvements, investment protection, and a seamless upgrade path for existing systems. The modular development model, which converges on a common Intel® Xeon®/Intel Itanium socket and motherboard, will be evaluated for future implementation opportunities.
Delivering performance and value with rich media capabilities at an affordable price.
See how a design company relies on an Intel® Xeon® processor E3 family-based server to run smoothly.
See how a doctor's office relies on an Intel® Xeon® processor E3 family-based server to run smoothly.
Intel® Integrated I/O merges the I/O controller onto the processor for reduced latency.
Video: introducing the 2nd generation Intel® Core™ processor family. (1:33)
Intel® Core™ processors secure mobility, online rich media, business operations. (1:55)
Rigorous Intel® Xeon® processor family tests track performance and efficiency in IT@Intel design center.
For data center servers or cloud, new Intel® Xeon® processors combine flexibility with efficiency.
Claude Lorenson on advantages gained from SQL Server 2008 R2* running on Intel® Xeon® processors. (3:25)
University of California, Irvine runs ATLAS* project with thousands of Intel® Xeon® processors 7400 series. (1:34)
Wind River software helps boost performance of 3rd Gen Intel® Core™ processor family.
Together, Intel and Microsoft create the foundation for intelligent, embedded devices.
NCR on how 3rd gen Intel® Core™ processor-based transaction retail solutions support their innovation strategy.
Using Intel® Intelligent Power Node Manager on Intel® Xeon® 5500 Processor Series Platforms. Energy Efficiency, Power Capping included. (2:16)
SciNet data center: large, energy-efficient with 30,000 Intel® Xeon® processor 5500 series cores. (4:07)
Leaded surface mount technology: more reliable assemblies with higher I/O, board density; less weight,...
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International packing specifications with rules and standards
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2000 Packaging Databook, Chapter 5: Physical constants of IC package materials.
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Ball grid array packaging with electrical modeling, performance, and physical structure
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The Intel® Xeon® processor E3 family servers are built for virtualization and deliver intelligent, adaptive...
The Intel® Atom™ processor powers a variety of devices such as tablets, smartphones, netbooks, hybrids and consumer...
Intel® Xeon® processor E7 family-based servers deliver mission-critical management and security capabilities.
Intel® Itanium® processors deliver robust performance and support today's most demanding business applications.
As the first level of Intel's latest processor family, the 3rd generation Intel® Core™ i3 processor delivers a fast,...

