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Motherboard Repair: Ball Grid Array Socket Rework

Demos replacing damaged socket components for motherboard repair with thermal profile development, board cleaning, and new component preparation.

Component Surface Mount Technology: Guide

Surface mount technology guide provides instructions and diagrams for more reliable assemblies, increasing density for less weight, volume, and cost.

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Additional Resources—Intel® Learning Network: Guide

This guide provides directions on how to access information on the Intel® Learning Network, such as Manufacturing Advantage Service documents.

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Corner Glue: Application Techniques and Materials

Reviews corner glue use as a component to reduce soldering joint strain, material selection criteria, and demonstrates proper application techniques.

Intel® LGA771 Series or Intel® LGA775 Series: Processor Insertion

Demonstrates procedures for insertion and removal of a processor with the Intel® LGA771 Series and Intel® LGA775 Series sockets.

Electrostatic Discharge Prevention Methods

Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.

Electrostatic Discharge Detection: Antenna and Oscilloscope

Demos antenna and oscilloscope use for electrostatic discharge detection, including the minimum tool requirements and how to set up the parameters.

North American Regional Logistics ISO 9001:2008 Certificate

Certifies that North American Regional Logistics complies with ISO 9001:2008 requirements for the distribution of microprocessors.

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Fab 11X ISO 9001:2008

Certifies that Fab 11X in Rio Rancho, New Mexico, complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and more.

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Intel Mask Operations ISO 9001:2008

Certifies that Intel Mask Operations in Santa Clara complies with ISO 9001:2008 requirements of wafer fabrication, associated equipment, and more.

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