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Corner Glue: Application Techniques and Materials

Reviews corner glue use as a component to reduce soldering joint strain, material selection criteria, and demonstrates proper application techniques.

Electrostatic Discharge Prevention Methods

Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.

Ball Grid Array Rework: Package-on-Package Devices

Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.

Factory Overview and Certification

Intel’s manufacturing organization, encompassing water fab, assembly, testing, boards, and outsourcing; locations, processes, certification.

Intel and SAP IoT Bring Actionable Insights to the Edge

Intel® IoT Gateway and sensors with SAP software provide real-time, actionable data at the edge, even without a WAN connection.

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Optimize Operations and Workforce with IoT Smart Manufacturing

Solution Brief: Intel and its partners demonstrate how smart manufacturing IoT solutions reduce operating expenses and increase revenue.

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Global Manufacturing at Intel

Explore Intel's global manufacturing process and see where computer chips are made at wafer fabs and assembly/testing sites around the world.

IoT Factory Deployment—Real-World Manufacturing Implementation

Intel uses IoT to capture real-time factory big data for faster decision making and predictions, improving performance while opening new opportunity.

Circuit Board Assembly: Vishay Micro-Measurements Strain Gage

Instructs how to attach a Vishay Micro-Measurements strain gage to Intel® Ball Grid Array packages, for measuring manufacturing board flexure.

Photon Emission and Probing Analysis

IC device functional analysis uses several methods to analyze light emissions, measure wave-forms, or alternate functional state; methods described.