Reviews corner glue use as a component to reduce soldering joint strain, material selection criteria, and demonstrates proper application techniques.
Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.
Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.
Demonstrates guidelines for package-on-package device rework, including developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.Full View >
Intel’s manufacturing organization, encompassing water fab, assembly, testing, boards, and outsourcing; locations, processes, certification.
Learn about Intel’s manufacturing organization, encompassing water fabrication, assembly, high-volume testing, board manufacturing, and outsourcing; includes factory locations, processes, and certification.
Intel® IoT Gateway and sensors with SAP software provide real-time, actionable data at the edge, even without a WAN connection.
Intel® IoT and other sensors feed data to Intel IoT Gateways running SAP software to provide real-time, actionable data at the edge and in the cloud or data center.
Solution Brief: Intel and its partners demonstrate how smart manufacturing IoT solutions reduce operating expenses and increase revenue.
Solution Brief: Hannover Messe, Intel and its solution partners demonstrate how smart manufacturing IoT solutions like asset solutions built on Intel® processor based platforms reduce operating expenses and increase revenue.
Intel uses IoT to capture real-time factory big data for faster decision making and predictions, improving performance while opening new opportunity.
Intel's manufacturing factory uses IoT to capture real-time big data between tools and systems for faster decision making, targeted response, and predictive outcomes, improving equipment performance at lower costs while opening new opportunities.Full View >
Instructs how to attach a Vishay Micro-Measurements strain gage to Intel® Ball Grid Array packages, for measuring manufacturing board flexure.
Instructs how to attach a Vishay Micro-Measurements strain gage to the primary side plan-of-record location on Intel® Ball Grid Array packages, for measuring manufacturing board flexure.Full View >
IC device functional analysis uses several methods to analyze light emissions, measure wave-forms, or alternate functional state; methods described.
Functional analysis of IC devices uses several techniques to analyze light emissions, measure wave-forms, or alternate the functional state of IC devices; photon-based techniques described.
Describes focused ion beam, scanning electron microscopy, and transmission electron microscopy tools used in physical and composition analysis.
Describes focused ion beam, scanning electron microscopy, transmission electron microscopy, and more tools used during physical and composition analysis of anomalies.