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Factory Overview and Certification

Intel’s manufacturing organization, encompassing water fab, assembly, testing, boards, and outsourcing; locations, processes, certification.

Global Manufacturing at Intel

Explore Intel's global manufacturing process and see where computer chips are made at wafer fabs and assembly/testing sites around the world.

Circuit Board Assembly: Vishay Micro-Measurements Strain Gage

Instructs how to attach a Vishay Micro-Measurements strain gage to Intel® Ball Grid Array packages, for measuring manufacturing board flexure.

Photon Emission and Probing Analysis

IC device functional analysis uses several methods to analyze light emissions, measure wave-forms, or alternate functional state; methods described.

Physical and Composition Analysis

Describes focused ion beam, scanning electron microscopy, and transmission electron microscopy tools used in physical and composition analysis.

Product Identification and Unit-Level Traceability

Intel’s system to manage and store product ID with unit-level traceability for CPUs and chipsets, and lot-level traceability for boards and systems.

Intel's Qualification Approach

Examine videos and related materials that demonstrate Intel's qualification approach methods, which ensure reliable and high-quality products.

Intel® Customer Manufacturing Enabling Provides High-Tech Support

Intel® Customer Manufacturing Enabling helps customers increase manufacturing success, assures growth, and provides services for process optimization.

Intel® Manufacturing Enabling Guide

Describes purpose of the Intel® Manufacturing Enabling Guide and provides links to chapters.

Non-Destructive Testing

Non-destructive techniques like X-ray, SAM, SQUID, TDR, and thermal imaging provide data without altering the electronic device; details provided.