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Surface Mount Board Assembly Soldering: Guide

Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

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Intel® Manufacturing Enabling Guide

Describes purpose of the Intel® Manufacturing Enabling Guide and provides links to chapters.

Intel Executive Perspectives on Quality and Reliability

Chief Executive Officer Paul Otellini and Director of the Corporate Quality Network Nasser Bozorg-Grayeli talk about their view of quality.

Corner Glue: Application Techniques and Materials

Reviews corner glue use as a component to reduce soldering joint strain, material selection criteria, and demonstrates proper application techniques.

Electrostatic Discharge Prevention Methods

Intel’s ESD prevention methods prevent costly damage to electronic devices; overview provides device models, theory, and case studies.

Ball Grid Array Rework: Package-on-Package Devices

Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.

Factory Overview and Certification

Intel’s manufacturing organization, encompassing water fab, assembly, testing, boards, and outsourcing; locations, processes, certification.

Global Manufacturing at Intel

Explore Intel's global manufacturing process and see where computer chips are made at wafer fabs and assembly/testing sites around the world.

Circuit Board Assembly: Vishay Micro-Measurements Strain Gage

Instructs how to attach a Vishay Micro-Measurements strain gage to Intel® Ball Grid Array packages, for measuring manufacturing board flexure.

Photon Emission and Probing Analysis

IC device functional analysis uses several methods to analyze light emissions, measure wave-forms, or alternate functional state; methods described.