See how Intel® Rack Scale Architecture works to manage storage servers and deploy storage pooling software, such as EMC ScaleIO, and CoprHD*.
Intel Fellow Mark Bohr discusses the new 14 nm transistor process and how the improved tri-gate fin design enables greater computing experiences.
Intel Fellow Mark Bohr discusses the new 14 nm transistor process and how the tri-gate fins are now taller, thinner, and closer together, enabling more performance, less active power, and longer battery life for greater computing experiences.Full View >
Shatter all the rules and unleash your processor's true potential with 3D XPoint™ technology, which creates fast, inexpensive, and nonvolatile memory.
Intel engineers help shatter all the rules with 3D XPoint™ technology, a simple, stackable, and transistor-less design that creates fast, inexpensive, and nonvolatile storage memory with low latency to unleash your processor's true potential.Full View >
See 3D XPoint™ technology unveiled—a breakthrough in non-volatile storage technology that is cheaper than DRAM and faster than NAND.
See 3D XPoint™ technology unveiled with a brief history of memory technology from the 1960's to now and how this next breakthrough that combines memory and storage in one non-volatile device that is cheaper than DRAM and faster than NAND.Full View >
Intel's Rob Crooke and Micron CEO Mark Durcan announce 3D XPoint™, a faster, denser, and non-volatile revolutionary breakthrough in memory technology.
Intel's Rob Crooke and Micron CEO Mark Durcan announce a revolutionary breakthrough in memory technology that can unlock the potential of our data. 3D XPoint™ is a new class of storage and memory technology that is faster, denser, and non-volatile.Full View >
3D XPoint™ is a new breakthrough in non-volatile memory technology enabling memory-like performance at storage-like capacity and cost.
A new breakthrough in non-volatile memory technology, Intel® 3D XPoint™ offers memory-like performance at storage-like capacity and cost for more affordable multi-terabyte memory arrays and faster SSD storage.
Backgrounder: Intel's 22nm innovation ushers in new semiconductor technology and ensures the continuation of Moore's Law.
For the first time in history, silicon transistors are entering the third dimension. Intel is introducing the tri-gate transistor, in which the transistor channel is raised into the 3rd dimension.
Intel introduces new 22nm technology.
Intel introduces a fundamentally different technology for future microprocessor families: 3-D transistors manufactured at 22nm. These new transistors enable Intel to continue to relentlessly pursue Moore's Law.