Presentation: Platform engineering and logic technology development group leaders cover the 14 nm product development vision, multi-year product journeys to reinvent the notebook, and the new Intel® Core™ processor microarchitecture.
Intel Fellow Mark Bohr discusses the new 14 nm transistor process and how the improved tri-gate fin design enables greater computing experiences.
Intel Fellow Mark Bohr discusses the new 14 nm transistor process and how the tri-gate fins are now taller, thinner, and closer together, enabling more performance, less active power, and longer battery life for greater computing experiences.Full View >
Backgrounder: Intel's 22nm innovation ushers in new semiconductor technology and ensures the continuation of Moore's Law.
For the first time in history, silicon transistors are entering the third dimension. Intel is introducing the tri-gate transistor, in which the transistor channel is raised into the 3rd dimension.
Explore Intel Fellow Mark Bohr's presentation from the Intel Developer Forum 2014, which covers some of the benefits of the new 14 nm transistor process, like improved area scaling, and microarchitecture optimizations for active power reduction.
Validate when a user logs in with Intel® Identity Protection Technology with public key infrastructure, a second factor authentication for business.
Verify Internet transactions using Intel® Identity Protection Technology with Public Key Infrastructure certificates, authenticating the user and server to each other to encrypt and digitally sign documents.
A systems engineer from the Intel Rack-Scale Architecture group shares a brief overview and demonstration of the features and benefits of Intel® RSA.
Intel Visual Technology integrates a suite of technologies in 2nd generation Intel® Core™ processors that delivers stunning visual experiences.
Intel Visual Technology integrates a suite of technologies built right into 2nd generation Intel® Core™ processors that delivers stunning visual experiences.
White Paper: the Intel® QuickPath Interconnect links stitch together processors in distributed shared memory platform architecture.
The Intel® QuickPath Interconnect is a high-speed, packetized, point-to-point interconnect used in Intel’s next generation of microprocessors. The narrow high-speed links stitch together processors in a distributed shared memory platform architecture.