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Building the Transparent Cloud

Case Study: Expedient Communications expands services with cloud infrastructure solutions using the Intel® Xeon® processor X5650.

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Cloud Computing Security Planning Guide for IT Managers

Cloud security guide to help IT managers plan cloud security, strengthening data center infrastructure and endpoint protection in the cloud.

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Intel® Socket Test Technology for LGA771

This document includes the theory on which Intel® Socket Test Technology is based, typical test methods, and device specification for LGA771.

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Intel's Packaging Databook Chapter 2: Package/Module/PC Card Outlines

Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel's Packaging Databook Chapter 8: Moisture Sensitivity/Desiccant Packaging/PSMCs Handling

Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.

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Intel's Packaging Databook Chapter 9: SMT Board Assembly Process Recs

Packaging Databook, Ch.9: solder paste printing, component placement, reflow soldering, and rework.

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