Intel® I/O Controller Hub 10 family covers errata, specification changes and clarifications, and document changes.
This document is a compilation of device and document errata and specification clarifications and changes, and is intended for hardware system manufacturers and for software developers of applications, operating systems, and tools.
Thermal and Mechanical Design Guide: Intel® 4 Series Chipset Family.
Discusses product specifications, thermal metrology, and reference thermal solution for the Intel® 4 Series Chipset.
Product Brief: Product overview, highlights, and features of Intel® Core™2 Duo processors E8400/E7400/E6400/E4300. (v.006, July 2009)
Product Brief: Product overview, highlights, and features of Intel® Core™2 Duo processors E8400/E7400/E6400/E4300 and Intel® Core™ microarchitecture for Embedded Computing. (v.006, July 2009)
Datasheet: Explains the mechanical and thermal specs for the Intel® Core™2 Extreme processor QX9000 and Quad Q9000/Q8000 series. (v.010, Aug. 2009)
Datasheet: Explains the electrical, mechanical, and thermal specifications for the Intel® Core™2 Extreme processor QX9000 series and Intel® Core™2 Quad processor Q9000/Q8000 series. (v.010, Aug. 2009)