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Embedded Intel® Xeon® Processor C5500/C3500, Intel® 3420 Chipset

The embedded Intel® Xeon® C5500 processor series with Intel® 3420 Chipset offers superior performance and PCI Express* non-transparent bridge.

Intel® Communications Chipset 89xx Series AMC Reference Design Kit

crystal-forest-amc-chipset-89xx-seriesreference-design-kit

Intel® Celeron® Processor Series: Application Power Guide Addendum

Application Power Guideline Addendum: Provides power consumption data on the Intel® Celeron® processor series. (v.1, January 2013)

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Advanced Board Bring Up: Power Up Sequencing Guide

White Paper: Explains power-up sequencing and debug for embedded platforms from power on to the first BIOS code fetch. (v.001, Apr. 2011)

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Embedded Intel® Architecture: Board Bring Up Procedure

White Paper: Explains motherboard stability tests and debug methods to solve issues during embedded Intel® architecture-based board bring up.

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PCB Stack-up Overview for Intel® Architecture Platforms

White Paper: PCB stack-up designs for Intel® Architecture platforms meet high-speed needs, addressing challenges with speed and costs. (Dec. 2008)

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Optimization of Multi-Core Processors Under Thermal Constraints

Presentation: Describes performance optimization for multi-core processors under thermal constraints at Intel® Embedded Education Summit 2010.

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Intel® Xeon® Processor C5500/C3500, 3420 Chipset: Block Diagram

Intel® Xeon® processor C5500 and C3500 series interactive block diagram provides a description of the functions, capabilities, and connectivity.

BOM Cost Reduction: Remove Intel® Atom™ Processor E6xx S3 State

White Paper: Intel® Atom™ processor E6xx power state overview shows Bill of Materials (BOM) cost reduction by removing S3 state. (v.001, May 2011)

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Intel® 4 Series Chipset: Thermal/Mechanical Design Guide

Thermal and Mechanical Design Guide: Intel® 4 Series Chipset Family.

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