ULV Intel® Celeron® M Processor for Embedded Apps Thermal Guide
This document provides thermal design guidelines for the ultra low voltage Intel® Celeron® M processor at 600 MHz for embedded applications in the Micro-Flip Chip Ball Grid Array (microFCBGA) package. Detailed mechanical and thermal specifications for this processor can be found in the ULV Intel® Celeron® M Processor Datasheet. This design guide specifically outlines recommendations and reference designs for natural convection (fanless) thermal solutions.
This document describes the thermal characteristics of the ULV Intel® Celeron® M Processor at 600 MHz and provides guidelines for meeting the thermal requirements imposed on a uni-processor system. The reference thermal solutions presented in this document are specifically designed for natural convection, applied computing applications in the mini-ITX and vertical compute blade form factors.
This document discusses the thermal management techniques for the ULV Intel® Celeron® M processor at 600 MHz, specifically in embedded computing applications. The physical dimensions and power numbers used in this document are for reference only. Please refer to the processor’s datasheet for the product dimensions, thermal design power, and maximum junction temperature. In case of conflict the data in the datasheet supersedes any data in this document.
Read the full Intel® Celeron® M Processor ULV for Embedded Apps Thermal Guide.