IXP43X Product Line Thermal Design Application Note
The document describes thermal design and characteristics of the IXP43X product line of network processors and suggests solutions for adequate cooling to maintain case temperature at optimal levels.
Read the full IXP43X Product Line Thermal Design Application Note.
Demonstrates attachment of strain gauges to measure manufacturing board flexure. (v.1, Jan. 2011)
Covers power profiling benefits and steps for real-time consumption measurements. (v.001, Dec. 2008)
Describes reference material and differences between embedded and non-embedded platforms.
Presentation: Product details and models of industrial, signage, and military use. (May 2010)
Introduces unified configuration and provision mode support. (v.1, March 2010)
Improving the performance of interrupt latency and Intel® AVX. (v.001, Aug. 2011)