Intel® Intelligent Power Technology
For exceptional energy efficiency
Available in servers built with the Intel® Xeon® processor E7 family, Intel® Xeon® processor E5 family, and Intel® Xeon processor E3 family, Intel® Intelligent Power Technology conserves power while delivering advanced power management capabilities at the rack, group, and data center levels. With the highest system-level performance per watt,1,2 this powerful technology enables businesses to boost IT performance while saving on energy costs and gaining headroom for growth.
Maximizing efficiency with instrumentation
Just as a pilot reads instruments to monitor the functions of an aircraft, the Intel® Node Manager (Intel® NM) utilizes instrumentation available on the Intel® Xeon® processor E3 family, Intel® Xeon® processor E5 family, and Intel® Xeon® processor E7 family to monitor, report, and cap system power to make the most of every watt consumed. Used with management consoles enabled with Intel® Data Center Manager (Intel® DCM), Intel® Node Manager provides a foundation for rack, data center, and facility-level management while improving data center energy efficiency and resource flexibility.
Dynamically scaling power consumption
Using integrated power gates, Intel Intelligent Power Technology reduces individual idling cores to near-zero power.3 These power gates can be controlled manually or through automated settings that adjust processors and memory to the lowest available power state to meet workload requirements without impacting performance. The technology reduces operating costs and can help meet environmental goals—all while allowing for more systems in a power-constrained data center.
Compared to first-generation Intel® quad-core processors, the Intel Xeon processor E5-2600 v2 family with Intel Intelligent Power Technology is up to 40 percent more energy efficient compared to the previous generation.
Intel® 22nm Technology
Intel continues to pursue a holistic set of enterprise data center targeted technologies that deliver energy efficiency at the silicon level, the server node level, and the data center rack level.
From a silicon perspective, the Intel® Xeon® processor E5-2600 v2 product family is built using the state-of-the-art 22nm silicon manufacturing process with 3-D tri-gate transistors. Intel's 3-D tri-gate transistor uses three gates wrapped around the silicon channel in a 3-D structure, enabling an unprecedented combination of performance and energy efficiency. Intel designed the new transistor to provide unique, ultra-low power benefits for use in handheld devices, like smart phones and tablets, while also delivering improved performance expected for high-end processors used in enterprise data centers.
1. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations, and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
2. Performance comparison using best submitted/published 2-socket single-node server results on the SPECpower_ssj*2008 benchmark as of 6 March 2012. Baseline score of 3,329 ssj_ops/watt published by Hewlett-Packard on the ProLiant DL360 G7* platform based on the prior generation Intel® Xeon® processor X5675. Score of 5,093 ssj_ops/watt submitted for publication by Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel Xeon processor E5-2660. For additional details, please visit http://www.spec.org. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.
3. Intel internal measurements of 221W at idle with Supermicro* 2xE5450 (3.0GHz 80W) processors, 8x2GB 667MHz FBDIMMs, 1x700W PSU, 1x320GB SATA hard drive vs. 111W at idle with Supermicro software development platform with 2xE5540 (2.53GHz Nehalem 80W) processors, 6x2GB DDR3-1066 RDIMMs, 1x800W PSU, 1x150GB 10k SATA hard drive. Both systems were running Windows* 2008 with USB suspend select enabled and maximum power savings mode for PCIe* link state power management. Measurements as of February 2009.