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Case Study: Sky Italia cuts software processing time and power consumption migrating to Itanium® processor-based HP Superdome2* servers for lower TCO.
White paper covers new RAS features, server integrity, top RAS differentiators, and competitive comparisons.
White Paper: assesses potential value and risks of an Itanium®-based server migration.
Watch how HP and Intel work together to deliver on the promise of mission-critical converged infrastructure.
Case Study: Hotelplan Group moves to the Intel® Itanium® processor 9000 sequence for enhanced performance, reliability, and cloud-ready capabilities.
Brief: The Intel® Itanium® processor 9500 series features new microarchitecture to deliver superior performance, reliability, and power efficiency.
White Paper: Itanium® processors are optimized for Explicitly Parallel Instruction Computing, enhancing parallelism for superior performance.
White Paper: New Intel® Itanium® processor has Instruction Replay technology, which identifies potential errors and corrects them almost instantly.
Case Study: MøllerGruppen reduces operation costs, minimizes business disruption, and provides a platform for growth with a HP mainframe migration.
Intel® Itanium® processor Technical Resources list includes applications notes, datasheets, packing information, product briefs, and more.
Learn about the Intel® Itanium® processor 9500 series: a powerful platform for virtualization and consolidation of today’s most demanding workloads.
Intel® Itanium® Processor Software Specifications
Case Study: HP servers provide reliable development trading system for Shanghai Stock Exchange, enabling growth for real-time processing, security.
Application Note: Intel® Itanium® processor family, recoverable machine check aborts (MCAs), and actions SAL firmware and the OS take to handle MCAs.
Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.
Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.
2000 Packaging Databook, Chapter 5: Physical constants of IC package materials.
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.