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Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide

Intel® Xeon® Processor E5-2400 Product Family: Thermal Guide

This document provides guidelines for the design of thermal and mechanical solutions for server and workstation processors in the Intel® Xeon® processor E5-2400 product family platform. The processors covered include those listed in the Intel® Xeon® processor E5-2400 product family datasheet - volume one. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1356 socket, the independent loading mechanism (ILM) and back plate.

The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.

Thermal profiles and other processor specifications are provided in the appropriate datasheet.

Read the full Intel® Xeon® Processor E5-2400 Product Family TMDG: http://www.intel.com/content/www/us/en/processors/xeon/xeon-e5-2400-thermal-guide.html

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