Describes focused ion beam, scanning electron microscopy, transmission electron microscopy, and more tools used during physical and composition analysis of anomalies.
Explains Intel’s system to manage and store product identification with unit-level traceability for CPUs and chipsets, and lot-level traceability for boards and systems.
Intel® Customer Manufacturing Enabling brings Intel expertise to customers through on-site visits and a library of training documents to increase manufacturing success, assure growth in new areas, and provide services for process optimization.
Describes purpose of the Intel® Manufacturing Enabling Guide and provides links to chapters.
Non-destructive techniques like X-ray, scanning acoustic microscopy, superconducting quantum interference device, time domain reflectometry, and thermal imaging provide data without altering the electronic device; descriptions provided.
Parametric fault isolation analyzes electrical behavior of input/output circuitry using a semiconductor parametric analyzer; includes graph.
Overview of quality and reliability summarizes each chapter of the Intel Quality System Handbook, describing Intel’s quality policy, quality management system, technology development, product development, materials quality, and more.
Logic fault isolation processes identify specific nodes for further analysis and use mostly automated tools leveraging design for testability features; scan and cache solutions defined.
Copy Exactly! is a methodology focusing on matching the manufacturing site to the development site used by fabrication, sort, and assembly test facilities to deliver product from multiple production sites.
Learn about Intel’s manufacturing organization, encompassing water fabrication, assembly, high-volume testing, board manufacturing, and outsourcing; includes factory locations, processes, and certification.