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Motherboard Repair: Ball Grid Array Socket Rework

Demos replacing damaged socket components for motherboard repair with thermal profile development, board cleaning, and new component preparation.

Component Surface Mount Technology: Guide

Surface mount technology guide provides instructions and diagrams for more reliable assemblies, increasing density for less weight, volume, and cost.

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Surface Mount Board Assembly Soldering: Guide

Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

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Electrostatic Discharge and Electrical Overstress: Guide

Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.

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Strain Measurement Methodology for Circuit Board Assembly: Guide

Guide: Explains how manufacturers can compare strain measurement results to the Intel strain guidance by creating a strain report.

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Shipping, Transport Media, and Moisture Sensitivity Level: Guide

The document outlines proper shipping and handling of semiconductors using packaging that accounts for moisture sensitivity and transportation stress.

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Additional Resources—Intel® Learning Network: Guide

This guide provides directions on how to access information on the Intel® Learning Network, such as Manufacturing Advantage Service documents.

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Corner Glue: Application Techniques and Materials

Reviews corner glue use as a component to reduce soldering joint strain, material selection criteria, and demonstrates proper application techniques.

Intel® LGA771 Series or Intel® LGA775 Series: Processor Insertion

Demonstrates procedures for insertion and removal of a processor with the Intel® LGA771 Series and Intel® LGA775 Series sockets.

Intel International BV ISO 9001:2008 Certificate

Certifies that Intel International BV complies with ISO 9001:2008 requirements for the distribution and storage of finished goods for the EMEA region.

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