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Intel® E8870 Chipset

Intel® E8870 Chipset, featuring the E8870SP component, allows for multi-node configurations of up to eight Intel® Itanium® processors.

Intel® Itanium® Processor Technical Resources

Technical Resources list for Intel® Itanium® Processor includes applications notes, datasheets, packing information, product briefs, and more.

Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel's Packaging Databook Chapter 8: Moisture Sensitivity/Desiccant Packaging/PSMCs Handling

Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.

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Intel's Packaging Databook Chapter 12: Tape Carrier Package

Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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Intel's Packaging Databook Chapter 15: The Chip Scale Package (CSP)

Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

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Intel Processor-based Server Platforms: Enhanced RAS Capabilities

White Paper: Enhanced reliability, availability, and serviceability (RAS) of Intel® processor-based server platforms simplify business solutions.

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EFI Cache Subclass Specification v0.9

Defines core code for an implementation of the cache data hub subclass of the Intel® Platform Innovation Framework for EFI.

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Intel® 7500 Scalable Memory Buffer Datasheet

Datasheet: Intel® 7500 Scalable Memory Buffer Datasheet.

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