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Monitor CPU Temperature with DTS and PECI

White Paper: Monitor CPU temperature data reported by on-die DTS and PECI to develop power management and thermal control schemes. (v.1, Sept. 2010)

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Embedded Intel® Xeon® Processors: Broad Product Line

Embedded Intel® Xeon® processor features, technical documents, tools, and software for the previous generation of processors.

Documentation for Quadrant ATCA with Intel® Technology

Zip file package contains documentation for a quadrant ATCA platform with Intel® technology, including schematics and bill of materials.

Cave Creek Chipset: Mechanical Package

Mechanical Package: Provides the Orcad* and Concept* symbols as well as the pin locations for the Cave Creek chipset.

Cave Creek: BSDL Files

Files: Contains Cave Creek BSDL files, reference design license agreement, read me, and JTAG boundary scan testability.

Cave Creek PCH Icepak* Thermal Model and User’s Guide

User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

Cave Creek PCH Flotherm* Thermal Model and User’s Guide

User’s Guide: Flotherm* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

Chief River/Maho Bay Platforms: Design Presentation

Design Presentation: Overview includes road map, benefits, technologies, and CRBs for the Chief River and Maho Bay platforms. (v.1.1, Apr. 2011)

CPIC with Cave Creek Technology: Bill of Materials

Bill of Materials: List of materials used on a CPIC platform with Cave Creek technology, including revision table of BOM changes.

Intel® I/O Controller Hub 9 Family: External Design Spec

Spec: Information for Intel® ICH9 family includes signal register and functional descriptions, and electrical and package features. (June 2008)