Intel® E7520 Chipset and Intel® E7320 Chipset

The Intel® E7520 and E7320 chipsets, with Intel® dual-processor (DP) server chipset technology, enable reduced power consumption and improved platform reliability and system manageability. These chipsets can deliver outstanding performance, dependability and value to enterprise front-end, small-medium business (SMB), or high performance computing (HPC) applications.

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Related Products

Processors Intel® Xeon® Processor
Chipsets Intel® E7525 Chipset
Server Boards Intel® Server Boards SE7520AF2, SE7520BD2, SE7520JR2, and SE7320SP2
Server Chassis Intel® Server Chassis SR1400 and SR2400
RAID Controller Intel® RAID Controllers SRCU42E and SRCZCRX
Other Ethernet products / Intel® IO332 I/O processor with Intel XScale® Architecture

Features and Benefits

Supports two Intel® Xeon® processors over an 800 MHz system bus for dual-processing workstation and server systems Optimized performance for multiple DP market segments and price points, supporting a larger number of users/transactions with faster response times.
800 MHz system bus capability Increased platform bus bandwidth (50% more than 533 MHz) delivers increased system performance.
PCI Express* Serial I/O technology that provides a direct connection between the MCH and PCI Express* devices with bandwidth up to 4 GB/s on each PCI Express* x8 interface; PCI Express offers higher bandwidth, lower latency and less I/O bottlenecks than PCI-X.
DDR2-400 memory interface Offers a maximum memory bandwidth of 6.4 GB/s. Decreased power consumption—especially important on dense rack, HPC and blade configurations. Increased DIMMs per system providing enhanced memory scalability for memory-intensive applications.
Intel® 6700PXH 64-bit PCI hub Optional component introduces next-generation PCI/PCI-X performance and significant enhancements to platform flexibility. Supports two independent 64-bit, 133 MHz. PCI-X segments and two hot-plug controllers (one per segment).
Intel® Hub Interface 1.5 connection to the Memory Controller Hub (MCH) Point-to-point connection between the MCH and the Intel® 82801ER I/O controller hub or Intel® 6300ESB I/O controller hub provides 266 MB/s of bandwidth.
Advanced platform RAS Features such as memory Error Correction Code (ECC), Intel® x4 Single Device Data Correction (x4 SDDC), DIMM sparring, DIMM scrubbingand memory mirroring can improve system reliability. 32-bit CRC on PCI Express*. SMBus port hooks into Intel® E7520 and Intel® E7320 chipsets for remote management operation and support for variety of third-party Base Management Controller (BMC) and BIOS solutions.

Additional information: 1 2

Packaging Information

Intel® E7520 Memory Controller Hub (MCH) 1077 Flip Chip-Ball Grid Array (FC-BGA)
Intel® E7320 Memory Controller Hub (MCH) 1077 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 6700PXH 64-bit PCI Hub 567 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 82801ER (ICH5R) 460 Micro Ball Grid Array (µBGA)
Intel® 6300ESB I/O Controller Hub 689 Plastic Ball Grid Array (PBGA)

مقاطع فيديو ذات صلة

معلومات المنتج والأداء


حالة الطاقة المخفضة L0s الخاصة بالناقل PCI Express غير مدعومة.

2In an x4 DDR memory device, the Intel® x4 Single Device Data Correction (x4 SDDC) provides error detection and correction for 1 to 4 data bits within a single device and provides error detection for up to 8 data bits within two devices.