Intel's new workstation chipset for the Intel® Xeon® processor 50001 series enables dual-processor (DP) balanced platforms that help businesses be more productive and efficient.
With the Intel® 5000X chipset, Intel® dual-core processor-based workstations incorporate next-generation technologies for enhanced performance and visualization critical to high-end, graphic-intensive DP computing. The Intel® 5000X chipset has passed workstation and server validation.
These new dual-core, dual-processor workstations deliver outstanding performance, dependability and value to digital content creation, mechanical computer-aided design (MCAD), electronic design automation, and other graphics workstation applications.
Product information
| Features and benefits | |
|---|---|
Supports two Intel® Xeon® processors 5000 series |
Optimized performance for the DP Server market segment with a range of price points. |
1066 / 1333 MHz dual independent buses |
Increased bus bandwidth of up to 3X over 800 MHz systems. |
FB DIMM 533/667 MHz memory interface |
Offers a maximum memory bandwidth up to 17 GB/s for 533 MHz and 21 GB/s for 667 MHz. |
PCI Express* X-16 graphics |
PCIe graphics interface, delivers as much as 4.0 GB/s of graphics bandwidth per direction directly into the Intel® 5000X MCH chipset (total bandwidth 8 GB/s). Enhanced visualization with the PCI Express x16 graphics interface, delivering twice the bandwidth of AGP 8X. |
Serial I/O technology provides a direct connection between the MCH chipset and PCI Express* component/adapters with bandwidth up to 4 GB/s on each PCI Express x8 interface. PCI Express offers higher bandwidth, lower latency and fewer I/O bottlenecks than PCI-X. |
|
Optional component introduces next-generation PCI/PCI-X performance and significant enhancements to platform flexibility. |
|
Advanced platform reliability, availability, and serviceability (RAS) |
Features such as memory Error Correction Code (ECC), Intel® x4 Single Device Data Correction (x4 SDDC), DIMM sparing and DIMM scrubbing for improved system reliability. |
Intel® Hub Interface 1.5 connection to the MCH chipset |
Point-to-point connection between the MCH chipset and the Intel® 82801ER I/O Controller Hub or Intel® 6300ESB I/O Controller Hub devices provides as much as 266 MB/s of bandwidth. |
Additional information: 2
مستندات تقنية
عرض المزيد من المستندات التقنية >-
Intel® 6400/6402...
Intel® 6400/6402 Advanced Memory Buffer core specification for a Fully Buffered DIMM memory system.
مراجعة | تنزيل -
Intel® 5000P/5000V/5000Z...
Describes thermal, mechanical, and electrical specifications, debugging, and pin tools.
مراجعة | تنزيل -
Intel® 5000X Chipset MCH...
designed for systems based on the Dual-Core Intel®Xeon® 5000 sequence.
مراجعة | تنزيل -
Intel® 631xESB/632xESB...
Intel® 631xESB/ 632xESB I/O Controller Hub signal and functional descriptions, mechanical...
مراجعة | تنزيل
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Thermal Guide, Intel®...
Intel® 6400 and 6402 Advanced Memory Buffer packaging technology, thermal specification, metrology and...
مراجعة | تنزيل -
Intel® 631xESB/632xESB...
Thermal and Mechanical Design Guide for Intel® 631xESB and 632xESB I/O Controller Hub.
مراجعة | تنزيل -
Intel® 5000 Series...
Packaging technology, thermal spec , metrology, and solution for the Intel® 5000 series Chipset MCH.
مراجعة | تنزيل
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Spec Update, Intel®...
Intel® 6400/6402 Advanced Memory Buffer changes, errata, specification changes, and clarifications.
مراجعة | تنزيل -
Intel® 631xESB/632xESB...
Intel® 631xESB/632xESB I/O Controller Hub (ESB2), device and document errata and specification changes.
مراجعة | تنزيل -
Spec Update, Intel® 5000...
Intel® 5000 series chipset Memory Controller Hub (MCH), clarifications, changes, and documentation...
مراجعة | تنزيل
| Packaging information | |
| Intel® 5000X Memory Controller Hub (MCH) chipset | 1432 Flip Chip-Ball Grid Array (FC-BGA) |
| Intel® 6700PXH 64-bit PCI Hub |
567 Flip Chip-Ball Grid Array (FC-BGA) |
| Intel® 6321ESB I/O Controller Hub | 1284 Flip Chip - Ball Grid Array (PBGA) |








