Demos removing and replacing damaged ball grid array socket components for motherboard repair.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.