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Get realistic graphics with Intel® visual technology, integrated in 3rd generation Intel® Core™ processors.
Discusses 64-bit desktop computing benefits from more physical and virtual applications.
White Paper: Intel® QuickPath Architecture unleashes the performance of future generations of Intel® multi-core microprocessors.
White Paper: the Intel® QuickPath Interconnect links stitch together processors in distributed shared memory platform architecture.
Video: Product Manager Netbooks and Tablets Group Larry Chao overviews the tablets on display in the Intel booth at CES 2011.
Video: Intel presents Cedar Trail next-gen Atom™ platform at IDF 2011.
Video: General Manager, Intel Storage Group David Tuhy reports from the Intel booth at the National Association of Broadcasters 2010 conference.
Presentation of 32nm logic technology for high performance microprocessors featuring 2nd generation high-k + metal gate transistors.
White paper provides manufacturing history on the 32-nm and 45-nm process technology and Hi-k + metal gate transistors.
Paper covers optimization for a 32nm SoC platform with 2nd Generation high-k/Metal gate transistors.
Gate Dielectric Scaling for High-Performance CMOS: SiO2 to High-K, an option for the 45nm high-performance logic technology node.
Demonstrates a Germanium p-channel QWFET with thin scaled TOXE and high mobility, delivering four times higher hole mobility.
Paper: n-type and p-type metal electrodes on high-K gate dielectrics enable same oxide thickness, desirable transistor threshold, and more.
Paper: composite high-K gate in the QWFET silicon substrate integration for thin electrical oxide, low gate leakage, and carrier confinement.
Presentation Discusses Role of High-K Gate Dielectrics and Metal Gate Electrodes in Emerging Nanoelectronic Devices.
Discusses low gate-leakage silicon and non-silicon transistor nanotechnology using high-κ gate dielectrics and metal gate electrodes.
Record NMOS and PMOS drive currents are reported, along with the tightest contacted gate pitch for a 32nm or 28nm technology.
Intel's innovative 32nm logic technology is a revolutionary technical breakthrough, delivering record NMOS and PMOS transistor performance.
Intel's Tick-Tock model maintains an innovation cadence in microprocessor manufacturing and microarchitecture with new advancements every other year.
Intel's Moore's Law inspires the creation of groundbreaking new technologies and energy efficiency.
Bold forecast inspires the creation of groundbreaking new technologies and more power-efficient processors. (For embedded developers.)
Intel's Moore's Law: Intel co-founder predicted the number of transistors on a chip would double every two years. (For mobile.)
Bold forecast inspires the creation of groundbreaking new technologies and more power-efficient processors. (For embedded developers.)
Paper: non-planar, multi-gate InGaAs QWFETs with high-K gate dielectric and ultra-scaled gate-to-drain and gate-to-source separations of 5nm.
Presentation: Intel introduces a fundamentally different technology for future microprocessor families, 3D transistors manufactured at 22nm.