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The Intel® Xeon® processor E7 family features advanced server reliability to handle mission-critical compute environments and virtualized workloads.
Built-In Hardware Features in Xeon® processor E7 family to minimize downtime and data loss; designed for more stability and scalability.
Discover how to implement server migration from expensive, proprietary platforms to Intel® technology-based solutions for mission-critical needs.
Brief: Intel IT evaluates the Intel® Xeon® processor E7-4800 family and finds it has the potential to deliver significant benefits for silicon design.
Thermal and Mechanical Design Guide: Intel® Xeon® Processor 7500 Series and Intel® Xeon® Processor E7-8800/4800/2800 Product Families.
Guide: Intel® Xeon® Processor E7 Family Uncore Performance Monitoring and Programming Guide.
Intel® Xeon® processor E7-8800/4800/2800 product families Datasheet, Vol. 1: Electrical, mechanical, thermal specifications.
Product demo outlines Intel® Xeon® E7 processor family benefits including low total cost of ownership, high security, scalability and reliability.
Application Note: how to use the CPUID instruction in software applications, BIOS implementations, and various processor tools.
Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Packaging Databook, Ch. 14: ball grid array packaging with electrical modeling, performance, and physical structure.
Packaging Databook, Ch. 16: The Single Edge Contact Cartridge and its physical structure, electrical modeling, and performance.
Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.
Mechanical Design Guide: mPGA604 Socket covers documentation, safety, mechanical, electrical, and validation requirements.
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.
Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.
Intel® Xeon® processor E7 family specifications
Ideal for high performance computing (HPC) applications that rely on high memory capacity.
Exceptional scalable performance with advanced reliability for your most data-demanding applications and intelligent performance.