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HP Leadership Performance Brief
The ProLiant DL980 G7* server based on the Intel® Xeon® processor E7 family continues to be the number one performance leader on the two-tier SAP Sales and Dis...

The ProLiant DL980 G7* server based on the Intel® Xeon® processor E7 family continues to be the number one performance leader on the two-tier SAP Sales and Distribution (SD) standard application benchmark with the latest Microsoft SQL Server eight-processor Windows* performance result.

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Intel Xeon Processor E7 Family: Enterprise Server Reliability [92 K]
The Intel® Xeon® processor E7 family features advanced server reliability to handle mission-critical compute environments and virtualized workloads.

The Intel® Xeon® processor E7 family features advanced server reliability to handle mission-critical compute environments and virtualized workloads.

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Enterprise Reliability - Intel Singapore [97 K]
Built-In Hardware Features in Xeon® processor E7 family to minimize downtime and data loss; designed for more stability and scalability.

Built-In Hardware Features in Xeon® processor E7 family to minimize downtime and data loss; designed for more stability and scalability.

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Server Migration: Transition to Intel®-based Solutions [97 K]
Discover how to implement server migration from expensive, proprietary platforms to Intel® technology-based solutions for mission-critical needs.

Discover how to implement server migration from expensive, proprietary platforms to Intel® technology-based solutions for mission-critical needs.

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Accelerating Silicon Design with Intel® Xeon® Processor E7 Family
Brief: Intel IT evaluates the Intel® Xeon® processor E7-4800 family and finds it has the potential to deliver significant benefits for silicon design.

Brief: Intel IT evaluates the Intel® Xeon® processor E7-4800 family and finds it has the potential to deliver significant benefits for silicon design.

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Intel® Xeon® Processor 7500 Series: Thermal/Mechanical Guide
Thermal and Mechanical Design Guide: Intel® Xeon® Processor 7500 Series and Intel® Xeon® Processor E7-8800/4800/2800 Product Families.

Thermal and Mechanical Design Guide: Intel® Xeon® Processor 7500 Series and Intel® Xeon® Processor E7-8800/4800/2800 Product Families.

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Transform Mission-Critical Computing
Intel® Xeon® processor E7-8800/4800/2800 offers mission-critical reliability managers expect, like Machine Check Architecture Recovery.

Intel® Xeon® processor E7-8800/4800/2800 offers mission-critical reliability managers expect, like Machine Check Architecture Recovery.

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Xeon® E7 Processor - RAS Servers White Paper
Enabling intensive applications for enterprise IT, the Intel® Xeon® processor E7 family offers a set of RAS features versus RISC-based solutions.

Enabling intensive applications for enterprise IT, the Intel® Xeon® processor E7 family offers a set of RAS features versus RISC-based solutions.

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Intel® Xeon® Processor E7 Family Uncore Performance Monitoring
Guide: Intel® Xeon® Processor E7 Family Uncore Performance Monitoring and Programming Guide.

Guide: Intel® Xeon® Processor E7 Family Uncore Performance Monitoring and Programming Guide.

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Intel® Xeon® Processor E7-8800/4800/2800: Datasheet, Vol. 1
Intel® Xeon® processor E7-8800/4800/2800 product families Datasheet, Vol. 1: Electrical, mechanical, thermal specifications.

Intel® Xeon® processor E7-8800/4800/2800 product families Datasheet, Vol. 1: Electrical, mechanical, thermal specifications.

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Intel® Xeon® E7 Processor Family: Product Demo [69 K]
Product demo outlines Intel® Xeon® E7 processor family benefits including low total cost of ownership, high security, scalability and reliability.

Product demo outlines Intel® Xeon® E7 processor family benefits including low total cost of ownership, high security, scalability and reliability.

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Intel Processor Identification and the CPUID Instruction
Application Note: how to use the CPUID instruction in software applications, BIOS implementations, and various processor tools.

Application Note: how to use the CPUID instruction in software applications, BIOS implementations, and various processor tools.

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Intel's Packaging Databook Chapter 1: Introduction
Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.

Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.

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Intel's Packaging Databook Chapter 10: Shipping and Transport Media
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Intel's Packaging Databook Chapter 14: Ball Grid Array (BGA) Packaging
Packaging Databook, Ch. 14: ball grid array packaging with electrical modeling, performance, and physical structure.

Packaging Databook, Ch. 14: ball grid array packaging with electrical modeling, performance, and physical structure.

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Intel's Packaging Databook Chapter 16: Cartridge Packaging
Packaging Databook, Ch. 16: The Single Edge Contact Cartridge and its physical structure, electrical modeling, and performance.

Packaging Databook, Ch. 16: The Single Edge Contact Cartridge and its physical structure, electrical modeling, and performance.

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Intel's Packaging Databook Chapter 15: The Chip Scale Package (CSP)
Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

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Design Guide: mPGA604 Socket for Intel® Xeon® Processors
Mechanical Design Guide: mPGA604 Socket covers documentation, safety, mechanical, electrical, and validation requirements.

Mechanical Design Guide: mPGA604 Socket covers documentation, safety, mechanical, electrical, and validation requirements.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 6: ESD/EOS
Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging
Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel® Xeon® Processor E7 Family Specifications [79 K]
Intel® Xeon® processor E7 family specifications

Intel® Xeon® processor E7 family specifications

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Intel® Xeon® Processor E7-4800 Product Family - High Performance Computing [75 K]
Ideal for high performance computing (HPC) applications that rely on high memory capacity.

Ideal for high performance computing (HPC) applications that rely on high memory capacity.

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Intel® Xeon® Processor E7-4800 Product Family - Server Benchmarks [74 K]
Exceptional scalable performance with advanced reliability for your most data-demanding applications and intelligent performance.

Exceptional scalable performance with advanced reliability for your most data-demanding applications and intelligent performance.

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